公开(公告)号：US20180079052A1

公开(公告)日：2018-03-22

申请号：US15710533

申请日：2017-09-20

Applicant: Applied Materials, Inc.

Inventor： Kun Xu ,  Kevin Lin ,  Ingemar Carlsson ,  Shih-Haur Shen ,  Tzu-Yu Liu

IPC: B24B49/02 ,  B24B47/10

CPC classification number: B24B49/02 ,  B24B37/013 ,  B24B37/105 ,  B24B37/205 ,  B24B37/22 ,  B24B47/10 ,  B24B49/04

Abstract: A method of polishing includes polishing a layer of a substrate, monitoring the layer of the substrate with an in-situ monitoring system to generate signal that depends on a thickness of the layer, filtering the signal to generate a filtered signal, determining an adjusted threshold value from an original threshold value and a time delay value representative of time required for filtering the signal, and triggering a polishing endpoint when the filtered signal crosses the adjusted threshold value.

公开(公告)号：US10427272B2

公开(公告)日：2019-10-01

申请号：US15710533

申请日：2017-09-20

Applicant: Applied Materials, Inc.

Inventor： Kun Xu ,  Kevin Lin ,  Ingemar Carlsson ,  Shih-Haur Shen ,  Tzu-Yu Liu

IPC: B24B49/02 ,  B24B47/10 ,  B24B37/013 ,  B24B37/10 ,  B24B37/20 ,  B24B37/22 ,  B24B49/04

Abstract: A method of polishing includes polishing a layer of a substrate, monitoring the layer of the substrate with an in-situ monitoring system to generate signal that depends on a thickness of the layer, filtering the signal to generate a filtered signal, determining an adjusted threshold value from an original threshold value and a time delay value representative of time required for filtering the signal, and triggering a polishing endpoint when the filtered signal crosses the adjusted threshold value.