公开(公告)号：US20240332092A1

公开(公告)日：2024-10-03

申请号：US18191697

申请日：2023-03-28

Applicant: Applied Materials, Inc.

Inventor： Zhiqiang HUANG ,  Li Ming TAN ,  Joanna Kejun LOH ,  Olivia Fatma KOENTJORO ,  Roger Alan LINDLEY

IPC: H01L21/66 ,  G05B13/02 ,  G05B13/04

CPC classification number: H01L22/12 ,  G05B13/0265 ,  G05B13/048

Abstract: The disclosure describes methods and systems for training and deploying a machine learning predictive model for use in a semiconductor manufacturing process. Specifically, the present disclosure provides for training machine learning predictive models for manufacturing components using design data, process parameters, gas flow configurations from a pixelated showerhead, temperature profile across an electrostatic chuck, and measured uniformity profiles of processed wafers. The present disclosure also provides for deploying the machine learning predictive model to effectuate real-time adjustments to a manufacturing process.