Control systems employing deflection sensors to control clamping forces applied by electrostatic chucks, and related methods
    2.
    发明授权
    Control systems employing deflection sensors to control clamping forces applied by electrostatic chucks, and related methods 有权
    使用偏转传感器控制由静电卡盘施加的夹紧力的控制系统及相关方法

    公开(公告)号:US09558981B2

    公开(公告)日:2017-01-31

    申请号:US14158112

    申请日:2014-01-17

    CPC classification number: H01L21/6833 H01L21/67288

    Abstract: A control system that includes deflection sensors which can control clamping forces applied by electrostatic chucks, and related methods are disclosed. By using a sensor to determine a deflection of a workpiece supported by an electrostatic chuck, a control system may use the deflection measured to control a clamping force applied to the workpiece by the electrostatic chuck. The control system applies a clamping voltage to the electrostatic chuck so that the clamping force reaches and maintains a target clamping force. In this manner, the clamping force may secure the workpiece to the electrostatic chuck to enable manufacturing operations to be performed while preventing workpiece damage resulting from unnecessary higher values of the clamping force.

    Abstract translation: 公开了一种包括能够控制由静电卡盘施加的夹持力的偏转传感器的控制系统及相关方法。 通过使用传感器来确定由静电卡盘支撑的工件的偏转,控制系统可以使用测量的偏转来控制由静电卡盘施加到工件的夹紧力。 控制系统对静电卡盘施加钳位电压,使得夹紧力达到并保持目标夹紧力。 以这种方式,夹紧力可以将工件固定到静电卡盘,以使得能够进行制造操作,同时防止由于不必要的较高的夹紧力而导致的工件损坏。

    APPARATUS, SYSTEMS, AND METHODS FOR TEMPERATURE CONTROL OF SUBSTRATES USING EMBEDDED FIBER OPTICS AND EPOXY OPTICAL DIFFUSERS
    7.
    发明申请
    APPARATUS, SYSTEMS, AND METHODS FOR TEMPERATURE CONTROL OF SUBSTRATES USING EMBEDDED FIBER OPTICS AND EPOXY OPTICAL DIFFUSERS 审中-公开
    使用嵌入式光纤和环氧光学扩散器的基板温度控制的装置,系统和方法

    公开(公告)号:US20160007412A1

    公开(公告)日:2016-01-07

    申请号:US14738448

    申请日:2015-06-12

    Abstract: Substrate temperature control apparatus and electronic device manufacturing systems provide pixelated light-based heating to a substrate in a process chamber. A substrate holder in the process chamber may include a baseplate. The baseplate has a top surface that may have a plurality of cavities and a plurality of grooves connected to the cavities. Optical fibers may be received in the grooves such that each cavity has a respective optical fiber terminating therein to transfer light thereto. Some or all of the cavities may have an epoxy optical diffuser disposed therein to diffuse light provided by the optical fiber. A ceramic plate upon which a substrate may be placed may be bonded to the baseplate. A thermal spreader plate may optionally be provided between the baseplate and the ceramic plate. Methods of controlling temperature across a substrate holder in an electronic device manufacturing system are also provided, as are other aspects.

    Abstract translation: 基板温度控制装置和电子装置制造系统向处理室中的基板提供像素化的基于光的加热。 处理室中的衬底保持器可以包括底板。 底板具有可以具有多个空腔的顶表面和连接到空腔的多个凹槽。 光纤可以被容纳在槽中,使得每个空腔具有终止于其中的相应光纤以将光传送到其上。 一些或所有空腔可以具有设置在其中的环氧光学漫射器以漫射由光纤提供的光。 可以将衬底放置在其上的陶瓷板可以结合到基板。 可以可选地在基板和陶瓷板之间设置散热板。 还提供了在电子设备制造系统中控制衬底保持器温度的方法,以及其他方面。

    OPTICAL FIBER TEMPERATURE SENSORS, TEMPERATURE MONITORING APPARATUS, AND MANUFACTURING METHODS

    公开(公告)号:US20170115169A1

    公开(公告)日:2017-04-27

    申请号:US14920758

    申请日:2015-10-22

    Inventor: Matthew Busche

    Abstract: An optical fiber temperature sensor including a lead-in fiber and black body emitter. The lead-in optical fiber includes a fiber end, and the black body emitter is fused on the fiber end, wherein the black body emitter is made up of a melted high emissivity material included integrally in melted silica. Further embodiments include temperature monitoring apparatus with one or more optical fiber temperature sensors, and electronic device processing apparatus including optical fiber temperature monitoring. Numerous other aspects and embodiments are included.

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