公开(公告)号：US10121688B2

公开(公告)日：2018-11-06

申请号：US15481183

申请日：2017-04-06

Applicant: APPLIED MATERIALS, INC.

Inventor： Matthew J. Busche ,  Vijay D. Parkhe ,  Wendell Boyd, Jr. ,  Senh Thach ,  Konstantin Makhratchev ,  Masanori Ono

IPC: H01L21/683 ,  H05K7/20 ,  H01L21/67

Abstract: An electrostatic chuck is described with external flow adjustments for improved temperature distribution. In one example, a method for adjusting coolant flow in an electrostatic chuck includes heating a dielectric puck, the dielectric puck being for electrostatically gripping a silicon wafer. Heat is detected at a plurality of locations on a top surface of the dielectric puck, the locations each being thermally coupled to at least one of a plurality of coolant chambers of the electrostatic chuck. A plurality of valves are adjusted to control coolant flow into the coolant chambers based on the detected heat.

公开(公告)号：US09558981B2

公开(公告)日：2017-01-31

申请号：US14158112

申请日：2014-01-17

Applicant: Applied Materials, Inc.

Inventor： Wendell Boyd, Jr. ,  Vijay D. Parkhe ,  Matthew Busche ,  Konstantin Makhratchev ,  Masanori Ono ,  Senh Thach

IPC: H01L21/683 ,  H01L21/67

CPC classification number: H01L21/6833 ,  H01L21/67288

Abstract: A control system that includes deflection sensors which can control clamping forces applied by electrostatic chucks, and related methods are disclosed. By using a sensor to determine a deflection of a workpiece supported by an electrostatic chuck, a control system may use the deflection measured to control a clamping force applied to the workpiece by the electrostatic chuck. The control system applies a clamping voltage to the electrostatic chuck so that the clamping force reaches and maintains a target clamping force. In this manner, the clamping force may secure the workpiece to the electrostatic chuck to enable manufacturing operations to be performed while preventing workpiece damage resulting from unnecessary higher values of the clamping force.

Abstract translation: 公开了一种包括能够控制由静电卡盘施加的夹持力的偏转传感器的控制系统及相关方法。 通过使用传感器来确定由静电卡盘支撑的工件的偏转，控制系统可以使用测量的偏转来控制由静电卡盘施加到工件的夹紧力。 控制系统对静电卡盘施加钳位电压，使得夹紧力达到并保持目标夹紧力。 以这种方式，夹紧力可以将工件固定到静电卡盘，以使得能够进行制造操作，同时防止由于不必要的较高的夹紧力而导致的工件损坏。

公开(公告)号：US09875923B2

公开(公告)日：2018-01-23

申请号：US15385441

申请日：2016-12-20

Applicant: Applied Materials, Inc.

Inventor： Wendell Boyd, Jr. ,  Vijay D. Parkhe ,  Matthew James Busche ,  Konstantin Makhratchev ,  Masanori Ono ,  Senh Thach

IPC: H01L21/683 ,  H01L21/67

CPC classification number: H01L21/6833 ,  H01L21/67288

Abstract: A control system that includes deflection sensors which can control clamping forces applied by electrostatic chucks, and related methods are disclosed. By using a sensor to determine a deflection of a workpiece supported by an electrostatic chuck, a control system may use the deflection measured to control a clamping force applied to the workpiece by the electrostatic chuck. The control system applies a clamping voltage to the electrostatic chuck so that the clamping force reaches and maintains a target clamping force. In this manner, the clamping force may secure the workpiece to the electrostatic chuck to enable manufacturing operations to be performed while preventing workpiece damage resulting from unnecessary higher values of the clamping force.

公开(公告)号：US09698041B2

公开(公告)日：2017-07-04

申请号：US14299850

申请日：2014-06-09

Applicant: Applied Materials, Inc.

Inventor： Matthew Busche ,  Wendell Boyd, Jr. ,  Vijay D. Parkhe ,  Michael R. Rice ,  Leon Volfovski

IPC: H01L21/687 ,  H01L21/67

CPC classification number: H01L21/68714 ,  H01L21/67103 ,  H01L21/67109 ,  H01L21/67115 ,  H01L21/67248

Abstract: Substrate temperature control apparatus including optical fiber temperature control are described. Substrate temperature control apparatus includes a base, a thermal contact member proximate to the base, and a plurality of optical fibers adapted to provide light-based heating extending laterally between the base and thermal contact member. Substrate temperature control systems and electronic device processing systems and methods including optical fiber temperature control are described, as are numerous other aspects.

公开(公告)号：US10736182B2

公开(公告)日：2020-08-04

申请号：US14738448

申请日：2015-06-12

Applicant: Applied Materials, Inc.

Inventor： Matthew Busche ,  Wendell Boyd, Jr. ,  Todd J. Egan ,  Gregory L. Kirk ,  Vijay D. Parkhe ,  Michael R. Rice ,  Leon Volfovski

IPC: H05B3/26 ,  H01L21/67 ,  H05B3/14

Abstract: Substrate temperature control apparatus and electronic device manufacturing systems provide pixelated light-based heating to a substrate in a process chamber. A substrate holder in the process chamber may include a baseplate. The baseplate has a top surface that may have a plurality of cavities and a plurality of grooves connected to the cavities. Optical fibers may be received in the grooves such that each cavity has a respective optical fiber terminating therein to transfer light thereto. Some or all of the cavities may have an epoxy optical diffuser disposed therein to diffuse light provided by the optical fiber. A ceramic plate upon which a substrate may be placed may be bonded to the baseplate. A thermal spreader plate may optionally be provided between the baseplate and the ceramic plate. Methods of controlling temperature across a substrate holder in an electronic device manufacturing system are also provided, as are other aspects.

公开(公告)号：US10403534B2

公开(公告)日：2019-09-03

申请号：US14536803

申请日：2014-11-10

Applicant: Applied Materials, Inc.

Inventor： Vijay D. Parkhe ,  Wendell Boyd, Jr. ,  Matthew James Busche ,  Konstantin Makhratchev ,  Masanori Ono ,  Senh Thach

IPC: H01L21/67 ,  H01J37/32 ,  H01L21/683

Abstract: Implementations described herein provide a pixelated substrate support assembly which enables both lateral and azimuthal tuning of the heat transfer between an electrostatic chuck and a cooling base comprising the substrate support assembly, which in turn, allows both lateral and azimuthal tuning of a substrate processed on the substrate support assembly. A processing chamber having a pixelated substrate support assembly and method for processing a substrate using a pixelated substrate support assembly are also provided.

公开(公告)号：US09986598B2

公开(公告)日：2018-05-29

申请号：US14737799

申请日：2015-06-12

Applicant: Applied Materials, Inc.

Inventor： Matthew Busche ,  Wendell Boyd, Jr. ,  Dmitry A. Dzilno ,  Vijay D. Parkhe ,  Michael R. Rice ,  Leon Volfovski

IPC: F24C7/00 ,  F21V9/00 ,  F26B3/30 ,  H05B3/00 ,  H01L21/67 ,  H05B1/02

CPC classification number: H05B3/0047 ,  H01L21/67103 ,  H01L21/67248 ,  H05B1/0233

Abstract: Substrate temperature control apparatus including groove-routed optical fibers. Substrate temperature control apparatus includes upper and lower members including grooves in one or both, and a plurality of optical fibers routed in the grooves. In one embodiment, the optical fibers are adapted to provide light-based pixelated heating. In another embodiment, embedded optical temperature sensors are adapted to provide temperature measurement. Substrate temperature control systems, electronic device processing systems, and methods including groove-routed optical fiber temperature control and measurement are described, as are numerous other aspects.