公开(公告)号：US20240160117A1

公开(公告)日：2024-05-16

申请号：US18282509

申请日：2021-04-02

Applicant: Applied Materials, Inc.

Inventor： Dmitry LUBOMIRSKY ,  Kyle M. HANSON ,  Douglas A. BUCHBERGER, Jr. ,  Alan L. TSO ,  Rahul KOZHIKKALKANDI ,  Paul R. MCHUGH ,  Jiayi SUN ,  Qiwei LIANG ,  Nithin Thomas ALEX ,  Lancelot HUANG ,  Ellie Y. YIEH

IPC: G03F7/00 ,  G03F7/40

CPC classification number: G03F7/70875 ,  G03F7/40 ,  G03F7/707 ,  G03F7/70758

Abstract: Apparatus and method for substrate processing are described herein. More specifically, the apparatus and method are directed towards apparatus and method for performing a field guided post exposure bake operation on a semiconductor substrate. The apparatus is a processing module (100) and includes an upper portion (102) with an electrode (400) and a base portion (104) which is configured to support a substrate (500) on a substrate support surface (159). The upper portion (102) and the base portion (104) are actuated toward and away from one another using one or more arms (112) and form a process volume (404). The process volume (404) is filled with a process fluid and the processing module (100) is rotated about an axis (A). An electric field is applied to the substrate (500) by the electrode (400) before the process fluid is drained from the process volume (404).