公开(公告)号：US20220317579A1

公开(公告)日：2022-10-06

申请号：US17222696

申请日：2021-04-05

Applicant: Applied Materials, Inc.

Inventor： Mangesh Ashok BANGAR ,  Gautam PISHARODY ,  Lancelot HUANG ,  Alan L. TSO ,  Douglas A. BUCHBERGER, JR. ,  Huixiong DAI ,  Dmitry LUBOMIRSKY ,  Srinivas D. NEMANI ,  Christopher Siu Wing Ngai

IPC: G03F7/20

Abstract: Embodiments of the present disclosure generally relate to apparatus and methods for verification and re-use of process fluids. The apparatus generally includes a tool for performing lithography, and a recirculation path coupled to the tool. The recirculation path generally includes a collection unit coupled at first end to a first end of the tool, and a probe coupled at a first end to a second end of the collection unit, the probe for determining one or more characteristics of a fluid flowing from the tool. The recirculation path of the apparatus further generally includes a purification unit coupled at a first end to a third end of the collection unit, the purification unit further coupled at a second end to a second end of the probe, the purification unit for changing a characteristic of the fluid.

公开(公告)号：US20240160117A1

公开(公告)日：2024-05-16

申请号：US18282509

申请日：2021-04-02

Applicant: Applied Materials, Inc.

Inventor： Dmitry LUBOMIRSKY ,  Kyle M. HANSON ,  Douglas A. BUCHBERGER, Jr. ,  Alan L. TSO ,  Rahul KOZHIKKALKANDI ,  Paul R. MCHUGH ,  Jiayi SUN ,  Qiwei LIANG ,  Nithin Thomas ALEX ,  Lancelot HUANG ,  Ellie Y. YIEH

IPC: G03F7/00 ,  G03F7/40

CPC classification number: G03F7/70875 ,  G03F7/40 ,  G03F7/707 ,  G03F7/70758

Abstract: Apparatus and method for substrate processing are described herein. More specifically, the apparatus and method are directed towards apparatus and method for performing a field guided post exposure bake operation on a semiconductor substrate. The apparatus is a processing module (100) and includes an upper portion (102) with an electrode (400) and a base portion (104) which is configured to support a substrate (500) on a substrate support surface (159). The upper portion (102) and the base portion (104) are actuated toward and away from one another using one or more arms (112) and form a process volume (404). The process volume (404) is filled with a process fluid and the processing module (100) is rotated about an axis (A). An electric field is applied to the substrate (500) by the electrode (400) before the process fluid is drained from the process volume (404).

公开(公告)号：US20230161260A1

公开(公告)日：2023-05-25

申请号：US17960798

申请日：2022-10-05

Applicant: Applied Materials, Inc.

Inventor： Dmitry LUBOMIRSKY ,  Douglas A. BUCHBERGER, Jr. ,  Hyunjun KIM ,  Alan L. TSO ,  Shekhar ATHANI ,  Qiwei LIANG ,  Ellie Y. YIEH

IPC: G03F7/20 ,  G03F7/16 ,  H01L21/67

CPC classification number: G03F7/2041 ,  G03F7/168 ,  H01L21/67115 ,  H01L21/67109

Abstract: A method and apparatus for performing post-exposure bake cooling operations is described herein. The method begins by post exposure baking a substrate disposed on heated substrate support in a process chamber, the process chamber having a showerhead. The heated substrate support is moved to increase a distance between the heated substrate support and a cooled plate of the showerhead. The substrate is separated from the heated substrate support using a substrate lifting device. The substrate is moved into a close proximity to the cooled showerhead. The substrate is cooled until the substrate is less than about 70 degrees Celsius. The substrate is spaced away from the cooled showerhead using the substrate lifting device and aligning the substrate with a substrate transfer passage of the processing chamber for removal by a robot.