公开(公告)号：US11049735B2

公开(公告)日：2021-06-29

申请号：US15598243

申请日：2017-05-17

Applicant: Applied Materials, Inc.

Inventor： Daniel O. Clark ,  Phil Chandler ,  Jay J. Jung

IPC: H01L21/67 ,  C23C14/56 ,  C23C16/44 ,  B01D53/38 ,  B01D53/74

Abstract: A method for operating an electronic device manufacturing system is provided that includes introducing an inert gas into a process tool vacuum pump at a first flow rate while the process tool is operating in a process mode, and introducing the inert gas into the process tool vacuum pump at a second flow rate while the process tool is operating in a chamber clean mode. Numerous other embodiments are provided.

公开(公告)号：US20170256425A1

公开(公告)日：2017-09-07

申请号：US15598243

申请日：2017-05-17

Applicant: Applied Materials, Inc.

Inventor： Daniel O. Clark ,  Phil Chandler ,  Jay J. Jung

IPC: H01L21/67 ,  C23C16/44 ,  B01D53/74 ,  B01D53/38 ,  C23C14/56

CPC classification number: H01L21/67017 ,  B01D53/38 ,  B01D53/74 ,  C23C14/56 ,  C23C16/4412 ,  Y10T137/0318 ,  Y10T137/0419

Abstract: A method for operating an electronic device manufacturing system is provided that includes introducing an inert gas into a process tool vacuum pump at a first flow rate while the process tool is operating in a process mode, and introducing the inert gas into the process tool vacuum pump at a second flow rate while the process tool is operating in a chamber clean mode. Numerous other embodiments are provided.

公开(公告)号：US09685352B2

公开(公告)日：2017-06-20

申请号：US14610301

申请日：2015-01-30

Applicant: Applied Materials, Inc.

Inventor： Daniel O. Clark ,  Phil Chandler ,  Jay J. Jung

IPC: H01L21/67 ,  C23C14/56 ,  B01D53/74 ,  C23C16/44 ,  B01D53/38

CPC classification number: H01L21/67017 ,  B01D53/38 ,  B01D53/74 ,  C23C14/56 ,  C23C16/4412 ,  Y10T137/0318 ,  Y10T137/0419

Abstract: An electronic device manufacturing system is provided that may reduce the amount of resources used in electronic device manufacturing processes. In some embodiments, unreacted ozone exiting a process tool operating in an ozone mode may be diverted and used as an oxidant in an abatement tool when the process tool is operating in a non-ozone mode. Numerous other embodiments are provided.

公开(公告)号：US20150136239A1

公开(公告)日：2015-05-21

申请号：US14610301

申请日：2015-01-30

Applicant: Applied Materials, Inc.

Inventor： Daniel O. Clark ,  Phil Chandler ,  Jay J. Jung

IPC: H01L21/67 ,  B01D53/38 ,  B01D53/74

CPC classification number: H01L21/67017 ,  B01D53/38 ,  B01D53/74 ,  C23C14/56 ,  C23C16/4412 ,  Y10T137/0318 ,  Y10T137/0419

Abstract: A method for operating an electronic device manufacturing system is provided that includes introducing an inert gas into a process tool vacuum pump at a first flow rate while the process tool is operating in a process mode; and introducing the inert gas into the process tool vacuum pump at a second flow rate while the process tool is operating in a clean mode. Numerous other embodiments are provided.

Abstract translation: 提供了一种用于操作电子装置制造系统的方法，其包括在处理工具以工艺模式运行时以惰性气体以第一流量引入惰性气体; 并且在处理工具以清洁模式操作时，以第二流量将惰性气体引入过程工具真空泵。 提供了许多其他实施例。