公开(公告)号：US10518418B2

公开(公告)日：2019-12-31

申请号：US15860102

申请日：2018-01-02

Applicant: Applied Materials, Inc.

Inventor： Dale R. Du Bois ,  Juan Carlos Rocha-Alvarez ,  Karthik Janakiraman ,  Hari K. Ponnekanti ,  Sanjeev Baluja ,  Prajeeth Wilton

IPC: H01L21/67 ,  B25J11/00 ,  H01L21/677

Abstract: The present disclosure generally relates to semiconductor process equipment used to transfer semiconductor substrates between process chambers. More specifically, embodiments described herein are related to systems and methods used to transfer, or swap, semiconductor substrates between process chambers using a transport device that employs at least two blades for the concurrent transfer of substrates between processing chambers.

公开(公告)号：US09889567B2

公开(公告)日：2018-02-13

申请号：US14972366

申请日：2015-12-17

Applicant: Applied Materials, Inc.

Inventor： Dale R. Du Bois ,  Juan Carlos Rocha-Alvarez ,  Karthik Janakiraman ,  Hari K. Ponnekanti ,  Sanjeev Baluja ,  Prajeeth Wilton

IPC: H01L21/677 ,  B25J11/00 ,  H01L21/67

CPC classification number: B25J11/0095 ,  H01L21/67196 ,  H01L21/67742 ,  H01L21/67748

Abstract: The present disclosure generally relates to semiconductor process equipment used to transfer semiconductor substrates between process chambers. More specifically, embodiments described herein are related to systems and methods used to transfer, or swap, semiconductor substrates between process chambers using a transport device that employs at least two blades for the concurrent transfer of substrates between processing chambers.