公开(公告)号：US20220084845A1

公开(公告)日：2022-03-17

申请号：US17023987

申请日：2020-09-17

Applicant: Applied Materials, Inc.

Inventor： Samartha Subramanya ,  Dmitry Lubomirsky ,  Mehmet Tugrul Samir ,  Lala Zhu ,  Martin Y. Choy ,  Son T. Nguyen ,  Pranav Gopal

IPC: H01L21/67 ,  B05B1/18 ,  C23C16/455 ,  H01L21/3065 ,  H01J37/305

Abstract: Exemplary semiconductor processing chambers may include showerhead. The chambers may include a pedestal configured to support a semiconductor substrate, where the showerhead and pedestal at least partially define a processing region within the semiconductor chamber. The chamber may include a spacer characterized by a first surface in contact with the showerhead and a second surface opposite the first surface. The chamber may include a pumping liner characterized by a first surface in contact with the spacer and a second surface opposite the first surface. The pumping liner may define a plurality of apertures within the first surface of the pumping liner.