SEMICONDUCTOR REFLOW PROCESSING FOR HIGH ASPECT RATIO FILL
    1.
    发明申请
    SEMICONDUCTOR REFLOW PROCESSING FOR HIGH ASPECT RATIO FILL 有权
    用于高比例比例的半导体回流处理

    公开(公告)号:US20130320505A1

    公开(公告)日:2013-12-05

    申请号:US13801860

    申请日:2013-03-13

    CPC classification number: H01L21/76882 H01L21/321 H01L21/76898

    Abstract: A method for at least partially filling a feature on a workpiece includes obtaining a workpiece including a feature having a high aspect ratio in the range of about 10 to about 80, depositing a first conformal conductive layer in the feature, and thermally treating the workpiece to reflow the first conformal conductive layer in the feature.

    Abstract translation: 用于至少部分地填充工件上的特征的方法包括获得包括具有在约10至约80范围内的高纵横比的特征的工件,在特征中沉积第一共形导电层,并将工件热处理为 回流特征中的第一保形导电层。

    Semiconductor reflow processing for high aspect ratio fill
    2.
    发明授权
    Semiconductor reflow processing for high aspect ratio fill 有权
    用于高纵横比填充的半导体回流加工

    公开(公告)号:US09245798B2

    公开(公告)日:2016-01-26

    申请号:US13801860

    申请日:2013-03-13

    CPC classification number: H01L21/76882 H01L21/321 H01L21/76898

    Abstract: A method for at least partially filling a feature on a workpiece includes obtaining a workpiece including a feature having a high aspect ratio in the range of about 10 to about 80, depositing a first conformal conductive layer in the feature, and thermally treating the workpiece to reflow the first conformal conductive layer in the feature.

    Abstract translation: 用于至少部分地填充工件上的特征的方法包括获得包括具有在约10至约80范围内的高纵横比的特征的工件,在特征中沉积第一共形导电层,并将工件热处理为 回流特征中的第一保形导电层。

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