公开(公告)号：US20240033877A1

公开(公告)日：2024-02-01

申请号：US18380376

申请日：2023-10-16

Applicant: Applied Materials, Inc.

Inventor： Vijayabhaskara Venkatagiriyappa ,  Nitin Bhargav ,  Tae Kwang Lee

IPC: B24B37/04 ,  C23C16/458 ,  B24B37/20

CPC classification number: B24B37/042 ,  C23C16/4583 ,  B24B37/20

Abstract: Apparatus and method for removing material from the susceptor of a batch processing chamber are described. The apparatus comprises a polishing tool including a rotatable platen positioned above the susceptor. A method comprises contacting material deposited on the susceptor with the rotatable platen to remove the material from the susceptor.

公开(公告)号：US20220055179A1

公开(公告)日：2022-02-24

申请号：US17000675

申请日：2020-08-24

Applicant: Applied Materials, Inc.

Inventor： Vijayabhaskara Venkatagiriyappa ,  Nitin Bhargav ,  Tae Kwang Lee

IPC: B24B37/04 ,  B24B37/20 ,  C23C16/458

Abstract: Apparatus and method for removing material from the susceptor of a batch processing chamber are described. The apparatus comprises a polishing tool including a rotatable platen positioned above the susceptor. A method comprises contacting material deposited on the susceptor with the rotatable platen to remove the material from the susceptor.

公开(公告)号：US20240141492A1

公开(公告)日：2024-05-02

申请号：US18125215

申请日：2023-03-23

Applicant: Applied Materials, Inc.

Inventor： Prasanth Narayanan ,  Vijayabhaskara Venkatagiriyappa ,  Keiichi Tanaka ,  Ning Li ,  Robert B. Moore ,  Robert C. Linke ,  Mandyam Sriram ,  Mario D. Silvetti ,  Michael Racine ,  Tae Kwang Lee

IPC: C23C16/458

CPC classification number: C23C16/4581 ,  C23C16/4583

Abstract: Susceptor assemblies having a susceptor base with a plurality of pockets formed in a surface thereof are described. Each of the pockets has a pocket edge angle in the range of 30 to 75° and a pocket edge radius in the range of 0.40±0.05 mm to 1.20 mm±0.05 mm. The pockets have a raised central region and an outer region that is deeper than the raised central region, relative to the surface of the surface of the susceptor base.

公开(公告)号：US12280465B2

公开(公告)日：2025-04-22

申请号：US18380376

申请日：2023-10-16

Applicant: Applied Materials, Inc.

Inventor： Vijayabhaskara Venkatagiriyappa ,  Nitin Bhargav ,  Tae Kwang Lee

IPC: B24B37/04 ,  B24B37/20 ,  C23C16/458

Abstract: Apparatus and method for removing material from the susceptor of a batch processing chamber are described. The apparatus comprises a polishing tool including a rotatable platen positioned above the susceptor. A method comprises contacting material deposited on the susceptor with the rotatable platen to remove the material from the susceptor.

公开(公告)号：US11826873B2

公开(公告)日：2023-11-28

申请号：US17000675

申请日：2020-08-24

Applicant: Applied Materials, Inc.

Inventor： Vijayabhaskara Venkatagiriyappa ,  Nitin Bhargav ,  Tae Kwang Lee

IPC: B24B37/04 ,  C23C16/458 ,  B24B37/20

CPC classification number: B24B37/042 ,  B24B37/20 ,  C23C16/4583

Abstract: Apparatus and method for removing material from the susceptor of a batch processing chamber are described. The apparatus comprises a polishing tool including a rotatable platen positioned above the susceptor. A method comprises contacting material deposited on the susceptor with the rotatable platen to remove the material from the susceptor.