公开(公告)号：US20040016636A1

公开(公告)日：2004-01-29

申请号：US10268284

申请日：2002-10-09

Applicant: Applied Materials, Inc.

Inventor： Michael X. Yang ,  Dmitry Lubomirsky ,  Yezdi Dordi ,  Saravjeet Singh ,  Sheshraj Tulshibagwale ,  Nicolay Kovarsky

IPC: C25B013/02

CPC classification number: H01L21/2885 ,  A23D7/00 ,  A23D7/005 ,  A23D7/01 ,  A23J7/00 ,  C07F9/103 ,  C25D7/123 ,  C25D17/001

Abstract: Embodiments of the invention may generally provide a small volume electrochemical plating cell. The plating cell generally includes a fluid basin configured to contain a plating solution therein, the fluid basin having a substantially horizontal weir. The cell further includes an anode positioned in a lower portion of the fluid basin, the anode having a plurality of parallel channels formed therethrough, and a base member configured to receive the anode, the base member having a plurality of groves formed into an anode receiving surface, each of the plurality of grooves terminating into an annular drain channel. A membrane support assembly configured to position a membrane immediately above the anode in a substantially planar orientation with respect to the anode surface is provided, the membrane support assembly having a plurality of channels and bores formed therein.

Abstract translation: 本发明的实施方案通常可以提供小体积的电化学电镀单元。 电镀槽通常包括配置成在其中容纳电镀液的流体池，流体池具有基本上水平的堰。 电池还包括位于流体槽的下部的阳极，阳极具有穿过其形成的多个平行通道，以及构造成容纳阳极的基座构件，底座构件具有形成为阳极接收的多个槽 多个槽中的每一个终止于环形排水通道。 提供了一种膜支撑组件，其被配置为将膜垂直于阳极定位在相对于阳极表面的基本上平面的方向上，膜支撑组件具有形成在其中的多个通道和孔。

公开(公告)号：US20040016648A1

公开(公告)日：2004-01-29

申请号：US10266477

申请日：2002-10-07

Applicant: Applied Materials, Inc.

Inventor： Dmitry Lubomirsky ,  Saravjeet Singh ,  Yezdi N. Dordi ,  Sheshraj Tulshibagwale

IPC: C25D017/00

CPC classification number: C25D17/02 ,  C25D7/123 ,  C25D17/001 ,  C25D21/00

Abstract: A method and apparatus for immersing a substrate for plating operations. The apparatus generally includes a plating cell configured contain a plating solution therein. The plating cell includes at least one fluid basin, a diffusion plate position in a lower portion of the at least one fluid basin, and an anode positioned below the diffusion plate, the anode and the diffusion plate being positioned in parallel orientation with each other and in a tilted orientation with respect to horizontal. The apparatus further includes a head assembly positioned proximate the plating cell, the head assembly including a base member, an actuator positioned at a distal end of the base member, and a substrate support assembly in mechanical communication with the actuator, the substrate support assembly being configured to support a substrate in the at least one fluid basin for processing in an orientation that is generally parallel to the diffusion plate.

Abstract translation: 一种用于浸渍电镀操作的基板的方法和装置。 该装置通常包括在其中包含电镀液的电镀单元。 所述电镀单元包括至少一个流体池，位于所述至少一个流体槽的下部的扩散板位置和位于所述扩散板下方的阳极，所述阳极和所述扩散板彼此平行取向地定位， 相对于水平方向倾斜。 所述装置还包括位于所述电镀单元附近的头部组件，所述头部组件包括基座构件，位于所述基座构件的远端的致动器以及与所述致动器机械连通的衬底支撑组件，所述衬底支撑组件 被配置为支撑所述至少一个流体池中的基底，用于以大致平行于所述扩散板的取向进行处理。