公开(公告)号：US20230274987A1

公开(公告)日：2023-08-31

申请号：US17680554

申请日：2022-02-25

Applicant: Applied Materials, Inc.

Inventor： Ruiping WANG ,  Shijing WANG ,  Selim NAHAS ,  Ying WANG ,  Guan Huei SEE

IPC: H01L21/66 ,  H01L21/67 ,  H01L21/687 ,  G05B19/4155

CPC classification number: H01L22/22 ,  G05B19/4155 ,  H01L21/67121 ,  H01L21/67259 ,  H01L21/68707 ,  G05B2219/43149 ,  G05B2219/50391

Abstract: Methods, apparatuses and systems in an integrated bonding system for optimizing bonding alignment between dies and a substrates include bonding, using a bonder of the integrated bonding system, a first die to a first substrate using preset alignment settings, transferring, using a transfer arm/robot of the integrated bonding system, the bonded die-substrate combination to an on-board inspection tool of the integrated bonding system, inspecting, at the on-board inspection tool, an alignment of the bond between the die and the substrate of the bonded die-substrate combination to determine a misalignment measure representing a misalignment of the bond between the die and the substrate of the bonded die-substrate combination, determining from the misalignment measurement, using a machine learning process, a correction measurement to be communicated to the bonder, and bonding, in the bonder, a different die to a different substrate using the determined machine-learning based correction measurement.