公开(公告)号：US20230288916A1

公开(公告)日：2023-09-14

申请号：US17692671

申请日：2022-03-11

Applicant: Applied Materials, Inc.

Inventor： Ying WANG ,  Xundong DAI ,  Guan Huei SEE ,  Ruiping WANG ,  Michael R. RICE ,  Hari Kishen PONNEKANTI ,  Nirmalya MAITY

IPC: G05B19/418 ,  H01L21/687 ,  H01L21/67

CPC classification number: G05B19/418 ,  H01L21/67121 ,  H01L21/68771 ,  H01L21/68778 ,  G05B2219/45031

Abstract: Apparatus for extending substrate queue time for hybrid bonding by preserving plasma activation. In some embodiments, the apparatus may include an environmentally controllable space with a support for holding a die or a substrate, a gas velocity accelerator that recirculates one or more gases laterally across the support, a filter, a humidifier apparatus that is fluidly connected to the environmentally controllable space, wherein the humidifier apparatus enables controllable humidity levels within the environmentally controllable space, a pressurizing apparatus fluidly connected to the humidifier apparatus on an output and fluidly connected to at least one gas supply on an input, a relative humidity (RH) sensor positioned within the environmentally controllable space, and an environment controller in communication with at least the humidifier apparatus and the RH sensor, wherein the environment controller is configured to maintain an RH level of approximately 80% to approximately 95%.

公开(公告)号：US20230274987A1

公开(公告)日：2023-08-31

申请号：US17680554

申请日：2022-02-25

Applicant: Applied Materials, Inc.

Inventor： Ruiping WANG ,  Shijing WANG ,  Selim NAHAS ,  Ying WANG ,  Guan Huei SEE

IPC: H01L21/66 ,  H01L21/67 ,  H01L21/687 ,  G05B19/4155

CPC classification number: H01L22/22 ,  G05B19/4155 ,  H01L21/67121 ,  H01L21/67259 ,  H01L21/68707 ,  G05B2219/43149 ,  G05B2219/50391

Abstract: Methods, apparatuses and systems in an integrated bonding system for optimizing bonding alignment between dies and a substrates include bonding, using a bonder of the integrated bonding system, a first die to a first substrate using preset alignment settings, transferring, using a transfer arm/robot of the integrated bonding system, the bonded die-substrate combination to an on-board inspection tool of the integrated bonding system, inspecting, at the on-board inspection tool, an alignment of the bond between the die and the substrate of the bonded die-substrate combination to determine a misalignment measure representing a misalignment of the bond between the die and the substrate of the bonded die-substrate combination, determining from the misalignment measurement, using a machine learning process, a correction measurement to be communicated to the bonder, and bonding, in the bonder, a different die to a different substrate using the determined machine-learning based correction measurement.

公开(公告)号：US20230129590A1

公开(公告)日：2023-04-27

申请号：US17508489

申请日：2021-10-22

Applicant: Applied Materials, Inc.

Inventor： Ying WANG ,  Ruiping WANG

IPC: H01L23/00 ,  H01L21/67 ,  H01L21/66 ,  C23C16/513 ,  H01L21/683

Abstract: Methods and apparatus for processing a substrate are provided herein. For example, a method for hybrid bonding a wafer comprises performing a first vacuum processing procedure on the wafer disposed within a first processing chamber, obtaining at least one of moisture measurements or organic species measurements within the first processing chamber, comparing the obtained at least one of moisture measurements or organic species measurements with a predetermined threshold, and one of when a comparison of the obtained at least one of moisture measurements or organic species measurements is equal to or less than the predetermined threshold automatically performing a second vacuum processing procedure in a second processing chamber different from the first processing chamber on the wafer, or when the comparison of the obtained at least one of moisture measurements or organic species measurements is greater than the predetermined threshold automatically continuing performing the first vacuum processing procedure on the wafer.

公开(公告)号：US20210222291A1

公开(公告)日：2021-07-22

申请号：US16096665

申请日：2016-05-24

Applicant: Applied Materials, Inc.

Inventor： Xi HUANG ,  Fei PENG ,  Kiran KRISHNAPUR ,  Ruiping WANG ,  Jrjyan Jerry CHEN ,  Steven VERHAVERBEKE ,  Robert Jan VISSER

IPC: C23C16/04 ,  C23C16/44 ,  H01L51/52 ,  H01L51/56

Abstract: A mask assembly (100) includes a mask frame (102) and a mask screen (104), both of the mask frame (102) and the mask screen (104) made of a metallic material, and a metal coating (125) disposed on exposed surfaces of one or both of the mask frame (102) and the mask screen (104).

公开(公告)号：US20240412948A1

公开(公告)日：2024-12-12

申请号：US18330687

申请日：2023-06-07

Applicant: Applied Materials, Inc.

Inventor： Shuran SHENG ,  Ruiping WANG ,  Raymond Hoiman HUNG ,  Ying W. WANG ,  Ke ZHENG

IPC: H01J37/32

Abstract: Embodiments of the disclosure provided herein include a system and method for plasma cleaning and activation using hybrid bonding. The system includes a processing chamber, a substrate support configured to support a substrate during hybrid bonding substrate processing, a gas delivery system coupled to the processing chamber having at least one radical generator, and a controller configured to cause the substrate processing system to form a first layer on a first substrate, dissociate a gas in the at least one radical generator to form a plasma, flow the plasma into the processing volume of the processing chamber for a period of time, exhaust the plasma, by products, and effluent gas from the processing volume after the period of time, and adhere a second layer disposed on a second substrate onto the first layer using a hybrid bonding technique.

公开(公告)号：US20240390950A1

公开(公告)日：2024-11-28

申请号：US18200539

申请日：2023-05-22

Applicant: Applied Materials, Inc.

Inventor： Ke ZHENG ,  Guan Huei SEE ,  Ying W. WANG ,  Ruiping WANG ,  Prayudi LIANTO

IPC: B08B1/00 ,  B08B1/02 ,  B08B3/02

Abstract: A brush box cleaning module is introduced as part of the pre-treatment process flow in an integrated hybrid bonding platform. It addresses the technical problem of achieving high cleanliness levels on die front-side and back-side surfaces, particularly by removing residues and particles induced by backgrinding tape and dicing tape. The brush box cleaning module efficiently removes stubborn residues and particles both chemically and mechanically, resulting in a clean and passivated surface without causing watermarks, scratches, corrosion, or surface roughness. This disclosed approach enhances the bonding yield and provides significant advantages over existing methods in die-stack hybrid bonding applications.

公开(公告)号：US20240096664A1

公开(公告)日：2024-03-21

申请号：US17945910

申请日：2022-09-15

Applicant: Applied Materials, Inc.

Inventor： Ruiping WANG ,  Ying WANG ,  Guan Huei SEE ,  Ananthkrishna JUPUDI ,  Praveen Kumar CHORAGUDI

IPC: H01L21/67 ,  B08B1/00 ,  B08B3/04 ,  B08B7/00 ,  B08B13/00 ,  F26B25/14 ,  G06T1/00

CPC classification number: H01L21/67207 ,  B08B1/001 ,  B08B3/04 ,  B08B7/0035 ,  B08B13/00 ,  F26B25/14 ,  G06T1/0014 ,  H01L21/6838

Abstract: Methods and apparatus for cleaning tooling parts in a substrate processing tool are provided herein. In some embodiments, a method of cleaning tooling parts in a substrate processing tool includes placing one or more dirty tools on a holder in a bonding chamber of a multi-chamber processing tool; transferring the holder from the bonding chamber to a cleaning chamber of the multi-chamber processing tool; cleaning the one or more dirty tools in the cleaning chamber to produce one or more cleaned tools; inspecting the one or more cleaned tools in an inspection chamber of the multi-chamber processing tool; and transferring the one or more cleaned tools to the bonding chamber

公开(公告)号：US20230207358A1

公开(公告)日：2023-06-29

申请号：US17564511

申请日：2021-12-29

Applicant: Applied Materials, Inc.

Inventor： Coby Scott GROVE ,  Ruiping WANG ,  Avinash SHANTARAM ,  Jitendra Ratilal BHIMJIYANI

IPC: H01L21/673 ,  H01L21/677

CPC classification number: H01L21/67303 ,  H01L21/67778

Abstract: Embodiments of equipment front end modules (EFEMs) are provided herein. In some embodiments, an EFEM includes: two or more loadports for receiving two or more types of substrates; an overhead storage unit having a plurality of storage shelves disposed above the two or more loadports and configured to hold two or more types of front opening unified pods (FOUPs) of different sizes that store the two or more types of substrates, respectively, wherein a horizontal alley is disposed between the plurality of storage shelves and the two or more loadports to provide a horizontal passageway for the FOUPs during transport to the two or more loadports; and an overhead transport system having a pair of vertical actuators disposed on opposite sides of the overhead storage unit and configured to transport FOUPs from the overhead storage unit to the two or more loadports.

公开(公告)号：US20250123569A1

公开(公告)日：2025-04-17

申请号：US18485147

申请日：2023-10-11

Applicant: Applied Materials, Inc.

Inventor： Yau Loong CHONG ,  Venkatakaushik VOLETI ,  Ruiping WANG ,  Mehdi VAEZ-IRAVANI

IPC: G03F7/00 ,  G06T7/00

Abstract: Embodiments of the disclosure include a method for forming a device comprising generating an image of a second die that is bonded on a first die that is bonded on a base substrate, the first die having a first feature formed on a first surface of the first die and the second die having a second feature formed on a second surface of the second die, determining a relative displacement between portions of the first feature and the second feature based on the generated image, and determining updated alignment instructions based on the determined relative displacement

公开(公告)号：US20240170443A1

公开(公告)日：2024-05-23

申请号：US17989826

申请日：2022-11-18

Applicant: Applied Materials, Inc.

Inventor： Ruiping WANG ,  Ying WANG ,  Raymond HUNG ,  Guan Huei SEE

IPC: H01L23/00 ,  H01L21/67

CPC classification number: H01L24/80 ,  H01L21/67132 ,  H01L21/67173 ,  H01L2224/80011 ,  H01L2224/80013 ,  H01L2224/80019 ,  H01L2224/80895 ,  H01L2224/80896

Abstract: A process flow for bonding a die to a substrate incorporates defectivity risk management and yield promotion by reducing flow complexity. In some embodiments, the process flow may include a radiation process on a component substrate to weaken an adhesive bonding of dies from a surface of the component substrate, a first wet clean process on the component substrate after the radiation process to clean die bonding surfaces, eject and pick processes after performing the first wet clean process to remove dies from the component substrate for bonding to a substrate, a plasma activation process on the substrate, a second wet clean process after the plasma activation process on the substrate to clean a substrate bonding surface of the substrate, and a hybrid bonding process to bond die bonding surfaces of the dies to the substrate bonding surface of the substrate.