公开(公告)号：US20200381276A1

公开(公告)日：2020-12-03

申请号：US16877357

申请日：2020-05-18

Applicant: Applied Materials, Inc.

Inventor： Srinivasa Rao YEDLA ,  Kirankumar Neelasandra SAVANDAIAH ,  Thomas BREZOCZKY ,  Bhaskar PRASAD ,  Shashikanth CHENNAKESHAVA ,  Sreenath SOVENAHALLI ,  Shankar KODLE

IPC: H01L21/67 ,  H01L21/687 ,  B25J15/00 ,  B25J9/04 ,  B25J11/00

Abstract: Aspects of the disclosure provided herein generally provide a substrate processing system that includes at least one processing module that includes a plurality of process stations coupled thereto and a substrate transferring device disposed within a transfer region of the processing module for transferring a plurality of substrates to two or more of the plurality of process stations. The methods and apparatuses disclosed herein are useful for performing vacuum processing on substrates wherein one or more substrates are transferred within the transfer region of processing module that is in direct communication with at least a portion of a processing region of a plurality of separately isolatable process stations during the process of transferring the one or more substrates. In some embodiments, a substrate is positioned and maintained on the same substrate support member during the process of transferring the substrate within the processing module and while the substrate is being processed in each of the plurality of process stations.

公开(公告)号：US20230178416A1

公开(公告)日：2023-06-08

申请号：US17923908

申请日：2021-04-12

Applicant: Applied Materials, Inc.

Inventor： Sreenath SOVENAHALLI ,  Kirankumar Neelasandra SAVANDAIAH ,  Bhaskar PRASAD ,  Srinivasa Rao YEDLA ,  Thomas BREZOCZKY

IPC: H01L21/687

CPC classification number: H01L21/68742

Abstract: A floating pin for positioning a substrate relative to a substrate support includes a shaft configured to move through a guide hole in a substrate support, and a pin head including a top surface and a flat shoulder surface disposed between the top surface and the shaft. The flat shoulder surface is configured to be seated on a recessed surface of the substrate support and seal the guide hole of the substrate support.

公开(公告)号：US20220068690A1

公开(公告)日：2022-03-03

申请号：US17008940

申请日：2020-09-01

Applicant: Applied Materials, Inc.

Inventor： Sreenath SOVENAHALLI ,  Kirankumar Neelasandra SAVANDAIAH ,  Lakshmikanth Krishnamurthy SHIRAHATTI ,  Srinivasa Rao YEDLA ,  Thomas BREZOCZKY

IPC: H01L21/683 ,  H01L21/677 ,  H01L21/67

Abstract: A method and apparatus for processing substrates is described herein. In one embodiment, a transfer apparatus is described that includes a blade, a plurality of support arms coupled to the blade, a plurality of grippers coupled to each of the support arms, and a grip actuator operably coupled to the support arms or one or more of the plurality of grippers.

公开(公告)号：US20210358797A1

公开(公告)日：2021-11-18

申请号：US16875750

申请日：2020-05-15

Applicant: Applied Materials, Inc.

Inventor： Sreenath SOVENAHALLI ,  Kirankumar Neelasandra SAVANDAIAH ,  Bhaskar PRASAD ,  Srinivasa Rao YEDLA ,  Thomas BREZOCZKY

IPC: H01L21/687

Abstract: A floating pin for positioning a substrate relative to a substrate support includes a shaft configured to move through a guide hole in a substrate support, and a pin head including a top surface and a flat shoulder surface disposed between the top surface and the shaft. The flat shoulder surface is configured to be seated on a recessed surface of the substrate support and seal the guide hole of the substrate support.