公开(公告)号：US20220108872A1

公开(公告)日：2022-04-07

申请号：US17063366

申请日：2020-10-05

Applicant: Applied Materials, Inc.

Inventor： Zubin Huang ,  Diwakar Kedlaya ,  Rui Cheng ,  Truong Van Nguyen ,  Manjunath Patil ,  Pavan Kumar Murali Kumar ,  Subrahmanyam Veerisetty ,  Karthik Janakiraman

IPC: H01J37/32 ,  C23C16/44 ,  C23C16/50 ,  C23C16/56

Abstract: Exemplary semiconductor processing systems may include a chamber body comprising sidewalls and a base. The systems may include a substrate support extending through the base of the chamber body. The substrate support may include a support plate defining a plurality of channels through an interior of the support plate. Each channel of the plurality of channels may include a radial portion extending outward from a central channel through the support plate. Each channel may also include a vertical portion formed at an exterior region of the support plate fluidly coupling the radial portion with a support surface of the support plate. The substrate support may include a shaft coupled with the support plate. The central channel may extend through the shaft. The systems may include a fluid source coupled with the central channel of the substrate support.

公开(公告)号：US20220108891A1

公开(公告)日：2022-04-07

申请号：US17064389

申请日：2020-10-06

Applicant: Applied Materials, Inc.

Inventor： Zubin Huang ,  Manjunath Veerappa Chobari Patil ,  Diwakar Kedlaya ,  Truong Van Nguyen ,  Pavan Kumar Murali Kumar ,  Subrahmanyam Veerisetty ,  Venkata Sharat Chandra Parimi ,  Fang Ruan

IPC: H01L21/033 ,  H01J37/32 ,  C23C16/50 ,  C23C16/455 ,  H01L21/02 ,  C23C16/04

Abstract: Exemplary semiconductor processing chambers may include a faceplate assembly characterized by at least one surface defining a number of voids. Each void is configured to receive an interchangeable thermal body that can be selected from multiple interchangeable thermal bodies. Exemplary semiconductor processing chambers may also include a gas box characterized by movable members. Each movable member is configured to engage a delivery port and is movable to provide flow control for a gas being delivered to the processing volume through a gas flow path. Zoned flow and/or temperature control may be provided by the faceplate assembly, the gas box, or both.