公开(公告)号：US20250166880A1

公开(公告)日：2025-05-22

申请号：US18512941

申请日：2023-11-17

Applicant: Applied Materials, Inc. ,  The Florida International University Board of Trustees

Inventor： Mohammad Mohtasim Hamid Pial ,  Mudit Sunilkumar Khasgiwala ,  Markondeyaraj Pulugurtha ,  Subramani Kengeri ,  Kunal Ghosh ,  Meghna Maheshkumar Patel ,  Sachin Jayant Patil ,  Arvin Khosravi

IPC: H01F27/24 ,  H01F27/28 ,  H01F27/32 ,  H01F41/04

Abstract: An inductor may include a flexible polyimide flexible core may including one or more cavities. The inductor may include a magnetic film, formed on two sides of the flexible polyimide flexible core and on a respective sidewall of each of the one or more cavities. The inductor may include a dielectric layer formed on the magnetic film. The inductor may also include a metal layer formed on the dielectric layer and within the cavities, such that vias are formed on one or more sides of the inductor and extend through the one or more cavities.

公开(公告)号：US20220404878A1

公开(公告)日：2022-12-22

申请号：US17845458

申请日：2022-06-21

Applicant: Applied Materials, Inc.

Inventor： Mudit Sunilkumar Khasgiwala ,  Subramani Kengeri

IPC: G06F1/16 ,  G06F1/20

Abstract: A method and system for applying materials to an electronic device may include generating an electromagnetic (EM) map of the device. The EM map may indicate locations of EM radiation emitted from the electronic device. The method may also include generating a thermal map of the electronic device that may indicate locations of thermal energy emitted from the device. The method may also include generating a shielding map from the EM thermal maps. The shielding map may include instructions to control a shielding apparatus, including locations on the electronic device to apply an EM shielding material and a thermal material. The method may also include controlling a shielding apparatus to apply the EM shielding material and thermal material to the electronic device, according to the shielding map. The EM shielding material and thermal material may be applied to varying depths on the electronic device.

公开(公告)号：US20250167132A1

公开(公告)日：2025-05-22

申请号：US18512439

申请日：2023-11-17

Applicant: Applied Materials, Inc. ,  The Florida International University Board of Trustees

Inventor： Ghaleb Saleh Ghaleb Al-Duhni ,  Mudit Sunilkumar Khasgiwala ,  Markondeyaraj Pulugurtha ,  Satheesh Bojja Venkatakrishnan ,  John Leonidas Volakis ,  Subramani Kengeri ,  Kunal Ghosh ,  Meghna Maheshkumar Patel ,  Sachin Jayant Patil ,  Arvin Khosravi

IPC: H01L23/552 ,  H01L23/13

Abstract: A shielding structure for a semiconductor device may include a first segment formed from a first set of layers including a first metal and a second metal. The structure may include a second segment formed from a second set of layers. The second set of layers may include the first metal and the second metal, the second segment orthogonal to the first segment, where the second segment is configured to be inserted into a trench in a substrate of the semiconductor device.

公开(公告)号：US20250166885A1

公开(公告)日：2025-05-22

申请号：US18512409

申请日：2023-11-17

Applicant: Applied Materials, Inc. ,  The Florida International University Board of Trustees

Inventor： Ghaleb Saleh Ghaleb Al-Duhni ,  Mudit Sunilkumar Khasgiwala ,  Markondeyaraj Pulugurtha ,  Mohammad Mohtasim Hamid Pial ,  Subramani Kengeri ,  Kunal Ghosh ,  Meghna Maheshkumar Patel ,  Sachin Jayant Patil ,  Arvin Khosravi

IPC: H01F27/36 ,  H01F27/24 ,  H01F41/02

Abstract: A scalable high-impedance component (SHIC) may include a flexible polyimide core may include one or more vias. The SHIC may include a magnetic film formed on one or more sides of the flexible polyimide core. The SHIC may include a polymer layer formed on the magnetic film, the polymer layer isolating the magnetic film and the flexible polyimide core. The SHIC may include a metal layer formed on the polymer layer and within the vias, such that the metal layer forms windings that extend through the one or more vias. The SHIC may include a magnetic paste disposed on the metal layer such that the SHIC shields a desired frequency of electromagnetic interference.

公开(公告)号：US20230009222A1

公开(公告)日：2023-01-12

申请号：US17811369

申请日：2022-07-08

Applicant: Applied Materials, Inc.

Inventor： Mudit Sunilkumar Khasgiwala ,  Subramani Kengeri

IPC: H04B15/00 ,  H04B17/318

Abstract: A method for controlling noise on an electronic device may include determining that a measured characteristic, associated with an antenna in a first configuration and included on the electronic device, violates a predetermined threshold. The method may also include identifying an aggressor in a second configuration, which may be a component on the electronic device. The aggressor may emit electromagnetic (EM) radiation that causes the measured characteristic to violate the predetermined threshold. One or more stimuli may be determined based on the first and/or second configurations that would cause the measured characteristic to no longer violate the predetermined threshold. One or more stimuli may be applied to the antenna and/or the aggressor, causing the measured characteristic to no longer violate the predetermined threshold.