公开(公告)号：US20200090907A1

公开(公告)日：2020-03-19

申请号：US16134200

申请日：2018-09-18

Applicant: Applied Materials, Inc.

Inventor： Junghoon Kim ,  Tae Cho ,  Theodore Wou ,  Soonam Park ,  Dmitry Lubomirsky

IPC: H01J37/32 ,  C23C16/513 ,  H01J37/305 ,  H01L21/3065

Abstract: Systems and methods may be used to enact plasma tuning. Exemplary semiconductor processing chambers may include a pedestal positioned within the chamber and configured to support a substrate. The pedestal may include an electrode operable to form a plasma within a processing region of the semiconductor processing chamber, with the processing region at least partially defined by the pedestal. The pedestal may include a heater embedded within the pedestal, and the heater may be coupled with a power supply. An RF filter may be coupled between the power supply and the heater. A shunt capacitor may also be coupled between the RF filter and the heater.

公开(公告)号：US09659753B2

公开(公告)日：2017-05-23

申请号：US14454493

申请日：2014-08-07

Applicant: Applied Materials, Inc.

Inventor： Tae Cho ,  Sang Won Kang ,  Dongqing Yang ,  Raymond W. Lu ,  Peter Hillman ,  Nicholas Celeste ,  Tien Fak Tan ,  Soonam Park ,  Dmitry Lubomirsky

IPC: H01J37/32

CPC classification number: H01J37/3255 ,  H01J37/32082

Abstract: A plasma source includes a first electrode and a second electrode having respective surfaces, and an insulator that is between and in contact with the electrodes. The electrode surfaces and the insulator surface substantially define a plasma cavity. The insulator surface defines one or more grooves configured to prevent deposition of material in a contiguous form on the insulator surface. A method of generating a plasma includes introducing one or more gases into a plasma cavity defined by a first electrode, a surface of an insulator that is in contact with the first electrode, and a second electrode that faces the first electrode. The insulator surface defines one or more grooves where portions of the insulator surface are not exposed to a central region of the cavity. The method further includes providing RF energy across the first and second electrodes to generate the plasma within the cavity.