APPARATUS AND METHOD TO REDUCE PARTICLE FORMATION ON SUBSTRATES IN POST SELECTIVE ETCH PROCESS

    公开(公告)号:US20180254203A1

    公开(公告)日:2018-09-06

    申请号:US15448090

    申请日:2017-03-02

    CPC classification number: H01L21/67103 H01L21/67109 H01L21/67201

    Abstract: The present disclosure generally relates to apparatuses and methods for reducing particle contamination on substrate surfaces. In one example, the apparatus is embodied as a load lock chamber including a top heater liner disposed over and coupled to a heater pedestal. The top heater liner generally includes a top plate and one or more walls, which support the top heater liner over the heater pedestal. Since the top heater liner is in contact with the heater pedestal, the top heater liner is generally heated to a temperature at which contaminating particles are volatile, such as greater than about 100° C. In operation, volatile fluorine passing through or adjacent to the hot top heater liner remains in gaseous form and thus are pumped out of the load lock chamber. The top heater liner thus advantageously reduces the potential for contaminating particles depositing on the substrate surface and improves overall production yield.

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