公开(公告)号：US20230100863A1

公开(公告)日：2023-03-30

申请号：US17486334

申请日：2021-09-27

Applicant: Applied Materials, Inc.

Inventor： Prayudi LIANTO ,  Yin Wei LIM ,  James S. PAPANU ,  Guan Huei SEE ,  Eric J. BERGMAN ,  Nur Yasmeen Addina MOHAMED HELMI ISIK ,  Wei Ying Doreen YONG ,  Vicknesh SAHMUGANATHAN ,  Yi Kun Kelvin GOH ,  John Leonard SUDIJONO ,  Arvind SUNDARRAJAN

IPC: H01J37/32 ,  H01L21/306

Abstract: Methods and apparatus for processing a substrate area provided herein. For example, methods for enhancing surface hydrophilicity on a substrate comprise a) supplying, using a remote plasma source, water vapor plasma to a processing volume of a plasma processing chamber to treat a bonding surface of the substrate, b) supplying at least one of microwave power or RF power at a frequency from about 1 kHz to 10 GHz and a power from about 1 kW to 10 kW to the plasma processing chamber to maintain the water vapor plasma within the processing volume during operation, and c) continuing a) and b) until the bonding surface of the substrate has a hydrophilic contact angle of less than 10°.