公开(公告)号：US20240399425A1

公开(公告)日：2024-12-05

申请号：US18205067

申请日：2023-06-02

Applicant: Applied Materials, Inc.

Inventor： Ying WANG ,  Eric J. BERGMAN

IPC: B08B3/10 ,  B08B3/02 ,  B08B5/02

Abstract: Embodiments of the disclosure include an apparatus and method of cleaning a substrate. The disclosure describes a method of cleaning a substrate includes supplying a gas at a gas temperature and a gas mass flow rate to a nozzle. The method also includes supplying a liquid at a liquid temperature and a liquid mass flow rate to the nozzle. The method also includes mixing the gas with the liquid in the nozzle to form a fluid mixture having a mixture temperature of not more than about 10° C. below the liquid temperature. The method also includes spraying the fluid mixture onto a surface of the substrate through an orifice in the nozzle.

公开(公告)号：US20230100863A1

公开(公告)日：2023-03-30

申请号：US17486334

申请日：2021-09-27

Applicant: Applied Materials, Inc.

Inventor： Prayudi LIANTO ,  Yin Wei LIM ,  James S. PAPANU ,  Guan Huei SEE ,  Eric J. BERGMAN ,  Nur Yasmeen Addina MOHAMED HELMI ISIK ,  Wei Ying Doreen YONG ,  Vicknesh SAHMUGANATHAN ,  Yi Kun Kelvin GOH ,  John Leonard SUDIJONO ,  Arvind SUNDARRAJAN

IPC: H01J37/32 ,  H01L21/306

Abstract: Methods and apparatus for processing a substrate area provided herein. For example, methods for enhancing surface hydrophilicity on a substrate comprise a) supplying, using a remote plasma source, water vapor plasma to a processing volume of a plasma processing chamber to treat a bonding surface of the substrate, b) supplying at least one of microwave power or RF power at a frequency from about 1 kHz to 10 GHz and a power from about 1 kW to 10 kW to the plasma processing chamber to maintain the water vapor plasma within the processing volume during operation, and c) continuing a) and b) until the bonding surface of the substrate has a hydrophilic contact angle of less than 10°.