公开(公告)号：US20230238267A1

公开(公告)日：2023-07-27

申请号：US17584503

申请日：2022-01-26

Applicant: Applied Materials, Inc.

Inventor： Ramesh GOPALAN ,  Robert Toshiharu HIRAHARA ,  Stanley WU ,  Michael Prestoza DECENA ,  Wendell BOYD ,  Siamak SALIMIAN ,  Thomas BREZOCZKY

IPC: H01L21/683 ,  H01L21/687 ,  H01L21/304

CPC classification number: H01L21/6833 ,  H01L21/68757 ,  H01L21/304

Abstract: Methods and apparatus reduce chucking abnormalities for electrostatic chucks by ensuring proper planarizing of ceramic surfaces of the electrostatic chuck. In some embodiments, a method for planarizing an upper ceramic surface of an electrostatic chuck assembly may comprise placing the electrostatic chuck assembly in a first planarizing apparatus, altering an upper ceramic surface of the electrostatic chuck assembly, and halting the altering of the upper ceramic surface of the electrostatic chuck assembly when an Sa parameter is less than approximately 0.1 microns, an Sdr parameter is less than approximately 2.5 percent, an Sz parameter is less than approximately 10 microns for any given area of approximately 10 mm2 of the upper ceramic surface, or a pit-porosity depth parameter of greater than 1 micron is less than approximately 0.1 percent of area of the upper ceramic surface.