公开(公告)号：US20250100105A1

公开(公告)日：2025-03-27

申请号：US18373657

申请日：2023-09-27

Applicant: Applied Materials, Inc.

Inventor： Michael Prestoza DECENA ,  Tsu-Hui YANG ,  Sridhar K. N. ,  Parthiban BALAKRISHNAN ,  Yuan LING ,  Sylvia SUN ,  Simpson WEN ,  Chih An CHANG ,  Tk WANG ,  Chao-Jian HUANG

IPC: B24B41/06 ,  B24B37/30

Abstract: The disclosure provides an apparatus for substrate polishing, the apparatus includes a housing member, a carrier member, and a distal force assembly. The carrier member is coupled to and disposed radially outward of the housing member. The distal force assembly disposed radially inward of an exterior portion of the carrier member and radially outward of the housing member. The distal force assembly includes a bladder seal, a seal ring in contact with the bladder seal. The seal ring has a seal ring face and one or more grooves disposed therein. The grooves include a plateau radius and a ridge radius disposed opposite the plateau radius at an intersection between the seal ring face and the grooves, wherein the plateau radius and the ridge radius are between about 0.012 to about 0.018 inches. The distal force assembly also includes a transfer ring coupled to the seal ring opposite the bladder.

公开(公告)号：US20230238267A1

公开(公告)日：2023-07-27

申请号：US17584503

申请日：2022-01-26

Applicant: Applied Materials, Inc.

Inventor： Ramesh GOPALAN ,  Robert Toshiharu HIRAHARA ,  Stanley WU ,  Michael Prestoza DECENA ,  Wendell BOYD ,  Siamak SALIMIAN ,  Thomas BREZOCZKY

IPC: H01L21/683 ,  H01L21/687 ,  H01L21/304

CPC classification number: H01L21/6833 ,  H01L21/68757 ,  H01L21/304

Abstract: Methods and apparatus reduce chucking abnormalities for electrostatic chucks by ensuring proper planarizing of ceramic surfaces of the electrostatic chuck. In some embodiments, a method for planarizing an upper ceramic surface of an electrostatic chuck assembly may comprise placing the electrostatic chuck assembly in a first planarizing apparatus, altering an upper ceramic surface of the electrostatic chuck assembly, and halting the altering of the upper ceramic surface of the electrostatic chuck assembly when an Sa parameter is less than approximately 0.1 microns, an Sdr parameter is less than approximately 2.5 percent, an Sz parameter is less than approximately 10 microns for any given area of approximately 10 mm2 of the upper ceramic surface, or a pit-porosity depth parameter of greater than 1 micron is less than approximately 0.1 percent of area of the upper ceramic surface.