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公开(公告)号:US20230187204A1
公开(公告)日:2023-06-15
申请号:US17844189
申请日:2022-06-20
Applicant: Applied Materials, Inc.
Inventor: Xiaodong Wang , Kevin Kashefi , Rongjun Wang , Shi You , Keith T. Wong , Yuchen Liu , Ya-Hsi Hwang , Jean Lu
IPC: H01L21/02 , H01L21/285
CPC classification number: H01L21/0234 , H01L21/28568
Abstract: Provided are methods for pre-cleaning a substrate. A substrate having tungsten oxide (WOx) thereon is soaked in tungsten fluoride (WF6), which reduces the tungsten oxide (WOx) to tungsten (W). Subsequently, the substrate is treated with hydrogen, e.g., plasma treatment or thermal treatment, to reduce the amount of fluorine present so that fluorine does not invade the underlying insulating layer.