公开(公告)号：US20230168139A1

公开(公告)日：2023-06-01

申请号：US17537807

申请日：2021-11-30

Applicant: Applied Materials, Inc.

Inventor： Sukti Chatterjee ,  David Masayuki Ishikawa ,  Yuriy V. Melnik ,  David A. Britz ,  Lance A. Scudder

IPC: G01L13/00

CPC classification number: G01L13/00 ,  B05B12/006

Abstract: Exemplary backpressure monitoring apparatuses may include a fluid supply source having a fluid port. The backpressure monitoring apparatuses may include a flow control mechanism fluidly coupled with the fluid port. The backpressure monitoring apparatuses may include a delivery tube fluidly coupled with the flow control mechanism and the fluid port. The backpressure monitoring apparatuses may include a pressure differential gauge fluidly coupled with the delivery tube. The pressure differential gauge may include an interface mechanism that is engageable with an outlet of a fluid flow device.

公开(公告)号：US11953390B2

公开(公告)日：2024-04-09

申请号：US17537807

申请日：2021-11-30

Applicant: Applied Materials, Inc.

Inventor： Sukti Chatterjee ,  David Masayuki Ishikawa ,  Yuriy V. Melnik ,  David A. Britz ,  Lance A. Scudder

IPC: G01L13/00 ,  B05B12/00 ,  G01F1/34

CPC classification number: G01L13/00 ,  G01F1/34 ,  B05B12/006

Abstract: Exemplary backpressure monitoring apparatuses may include a fluid supply source having a fluid port. The backpressure monitoring apparatuses may include a flow control mechanism fluidly coupled with the fluid port. The backpressure monitoring apparatuses may include a delivery tube fluidly coupled with the flow control mechanism and the fluid port. The backpressure monitoring apparatuses may include a pressure differential gauge fluidly coupled with the delivery tube. The pressure differential gauge may include an interface mechanism that is engageable with an outlet of a fluid flow device.

公开(公告)号：US20220375723A1

公开(公告)日：2022-11-24

申请号：US17741228

申请日：2022-05-10

Applicant: Applied Materials, Inc.

Inventor： Lance A. Scudder ,  Sukti Chatterjee ,  David Masayuki Ishikawa ,  Yuriy V. Melnik ,  Vibhas Singh

IPC: H01J37/32 ,  C23C16/40 ,  C23C16/455

Abstract: Exemplary methods of forming a coating of material on a substrate may include forming a plasma of a first precursor and an oxygen-containing precursor. The first precursor and the oxygen-containing precursor may be provided in a first flow rate ratio. The methods may include depositing a first layer of material on the substrate. While maintaining the plasma, the methods may include adjusting the first flow rate ratio to a second flow rate ratio. The methods may include depositing a second layer of material on the substrate.

公开(公告)号：US20220372620A1

公开(公告)日：2022-11-24

申请号：US17741252

申请日：2022-05-10

Applicant: Applied Materials, Inc.

Inventor： Lance A. Scudder ,  Sukti Chatterjee ,  David Masayuki Ishikawa ,  Yuriy V. Melnik ,  Vibhas Singh

IPC: C23C16/455 ,  H01J37/32 ,  C23C16/50 ,  C23C16/40 ,  C23C16/34 ,  C23C16/02 ,  C23C16/44 ,  C23C16/54

Abstract: Exemplary methods of forming a coating of material on a substrate may include forming a plasma of a first precursor and an oxygen-containing precursor. The first precursor and the oxygen-containing precursor may be provided in a first flow rate ratio. The methods may include depositing a first layer of material on the substrate. While maintaining the plasma, the methods may include adjusting the first flow rate ratio to a second flow rate ratio. The methods may include depositing a second layer of material on the substrate.