公开(公告)号：US20220363947A1

公开(公告)日：2022-11-17

申请号：US17741658

申请日：2022-05-11

Applicant: Applied Materials, Inc.

Inventor： Vibhas Singh ,  Wen-Hao Wu ,  Jrjyan Jerry Chen ,  Soo Young Choi

IPC: C09D183/08 ,  B65D25/34 ,  C23C14/00 ,  C23C14/54

Abstract: Packaging materials and methods of manufacture are disclosed. The packaging material comprises a substrate surface and film coating selected from the group consisting of an elastomer, a polymer, an inorganic material and combinations thereof. The film coating includes a first layer and a second layer, the first layer deposited on the second layer. The first layer has a formula of SiOxNyCz, where x is in a range from 1.9 to 2.15, y is in a range from 0.01 to 0.08, and z is in a range from 0.10 to 0.40.

公开(公告)号：US20220375723A1

公开(公告)日：2022-11-24

申请号：US17741228

申请日：2022-05-10

Applicant: Applied Materials, Inc.

Inventor： Lance A. Scudder ,  Sukti Chatterjee ,  David Masayuki Ishikawa ,  Yuriy V. Melnik ,  Vibhas Singh

IPC: H01J37/32 ,  C23C16/40 ,  C23C16/455

Abstract: Exemplary methods of forming a coating of material on a substrate may include forming a plasma of a first precursor and an oxygen-containing precursor. The first precursor and the oxygen-containing precursor may be provided in a first flow rate ratio. The methods may include depositing a first layer of material on the substrate. While maintaining the plasma, the methods may include adjusting the first flow rate ratio to a second flow rate ratio. The methods may include depositing a second layer of material on the substrate.

公开(公告)号：US20220372620A1

公开(公告)日：2022-11-24

申请号：US17741252

申请日：2022-05-10

Applicant: Applied Materials, Inc.

Inventor： Lance A. Scudder ,  Sukti Chatterjee ,  David Masayuki Ishikawa ,  Yuriy V. Melnik ,  Vibhas Singh

IPC: C23C16/455 ,  H01J37/32 ,  C23C16/50 ,  C23C16/40 ,  C23C16/34 ,  C23C16/02 ,  C23C16/44 ,  C23C16/54

Abstract: Exemplary methods of forming a coating of material on a substrate may include forming a plasma of a first precursor and an oxygen-containing precursor. The first precursor and the oxygen-containing precursor may be provided in a first flow rate ratio. The methods may include depositing a first layer of material on the substrate. While maintaining the plasma, the methods may include adjusting the first flow rate ratio to a second flow rate ratio. The methods may include depositing a second layer of material on the substrate.