公开(公告)号：US09864280B2

公开(公告)日：2018-01-09

申请号：US14874353

申请日：2015-10-02

Applicant: Applied Materials Inc.

Inventor： Mangesh Bangar ,  Bruce E. Adams ,  Kelly E. Hollar ,  Abhilash J Mayur ,  Huixiong Dai ,  Jaujiun Chen

IPC: G06F7/20 ,  G03F9/00 ,  G03F7/20

CPC classification number: G03F7/70633

Abstract: A calibration curve for a wafer comprising a layer on a substrate is determined. The calibration curve represents a local parameter change as a function of a treatment parameter associated with a wafer exposure to a light. The local parameter of the wafer is measured. An overlay error is determined based on the local parameter of the wafer. A treatment map is computed based on the calibration curve to correct the overlay error for the wafer. The treatment map represents the treatment parameter as a function of a location on the wafer.