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Patent Agency Ranking
公开(公告)号：US20210239623A1
公开(公告)日：2021-08-05
申请号：US16782005
申请日：2020-02-04
Applicant: Applied Materials Israel Ltd.
Inventor： Yotam SOFER , Shaul ENGLER , Boaz COHEN , Saar SHABTAY , Amir BAR , Marcelo Gabriel BACHER
IPC: G01N21/88
Abstract: A system, method and computer readable medium for examining a specimen, the method comprising: obtaining defects of interest (DOIs) and false alarms (FAs) from a review subset selected from a group of potential defects received from an inspection tool, each potential defect is associated with attribute values defining a location of the potential defect in an attribute space; generating a representative subset of the group, comprising potential defects selected in accordance with a distribution of the potential defects within the attribute space, and indicating the potential defects in the representative subset as FA; and upon training a classifier using data informative of the attribute values of the DOIs, the potential defects of the representative subset, and respective indications thereof as DOIs or FAs, applying the classifier to at least some of the potential defects to obtain an estimation of a number of expected DOIs in the specimen.
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公开(公告)号：US20230377125A1
公开(公告)日：2023-11-23
申请号：US17748996
申请日：2022-05-19
Applicant: Applied Materials Israel Ltd.
Inventor： Boaz DUDOVICH , Assaf ARIEL , Amir BAR , Lior YEHIELI , Chen ITZIKOWITZ , Shiran BEN ISRAEL , Lior KATZ , Eli Oren JONI , Eyal ROT
CPC classification number: G06T7/001 , G06T3/0056 , H04N7/01 , G06T2207/20081 , G06T2207/30148
Abstract: There is provided a system and method of defect detection of a semiconductor specimen. The method includes obtaining a first image of the specimen acquired at a first bit depth, converting by a first processor the first image to a second image with a second bit depth lower than the first bit depth, transmitting the second image to a second processor configured to perform first defect detection on the second image using a first defect detection algorithm to obtain a first set of defect candidates, and sending locations of the first set of defect candidates to the first processor, extracting, from the first image, a set of image patches corresponding to the first set of defect candidates based on the locations, and performing second defect detection on the set of image patches using a second defect detection algorithm to obtain a second set of defect candidates.
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公开(公告)号：US20230288345A1
公开(公告)日：2023-09-14
申请号：US18196655
申请日：2023-05-12
Applicant: Applied Materials Israel Ltd.
Inventor： Amir BAR
CPC classification number: G01N21/9501 , G06T7/0004 , G06T2207/30148
Abstract: A method of automatic optimization of an examination recipe includes obtaining inspection data of a given layer of a semiconductor specimen acquired by an inspection tool during runtime examination, the inspection data including inspection images representative of defect candidates from a defect map of the given layer, extracting inspection features characterizing the inspection images, and using a classifier to classify the defect candidates based on the inspection features, giving rise to a list of defect candidates having a higher probability of being defects of interest (DOIs). The semiconductor specimen includes multiple layers, and the classifier is a general-purpose classifier (GPC) usable for runtime classification of inspection data from any layer of the multiple layers of the semiconductor specimen, the GPC being previously trained using training data including inspection features characterizing training inspection images of various types of DOIs and nuisances collected from the multiple layers and label data associated therewith.
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公开(公告)号：US20220205928A1
公开(公告)日：2022-06-30
申请号：US17697063
申请日：2022-03-17
Applicant: Applied Materials Israel Ltd.
Inventor： Amir BAR
Abstract: There is provided a system and method of automatic optimization of an examination recipe. The method includes obtaining one or more inspection images each representative of at least a portion of the semiconductor specimen, the one or more inspection images being indicative of respective defect candidates selected from a defect map using a first classifier included in the examination recipe; obtaining label data respectively associated with the one or more inspection images and informative of types of the respective defect candidates; extracting inspection features characterizing the one or more inspection images; retraining the first classifier using the first features and the label data, giving rise to a second classifier; and optimizing the examination recipe by replacing the first classifier with the second classifier; wherein the optimized examination recipe is usable for examining a subsequent semiconductor specimen.
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公开(公告)号：US20230408423A1
公开(公告)日：2023-12-21
申请号：US17845953
申请日：2022-06-21
Applicant: Applied Materials Israel Ltd.
Inventor： Paz YABBO , Boaz DUDOVICH , Bhavna GHAI , Amir BAR
CPC classification number: G01N21/9501 , G06N3/08 , G06T7/0004 , G06T2207/30148 , G06T2207/20081
Abstract: There is provided a system and method of optimizing an inspection recipe for inspecting a semiconductor specimen. The method includes obtaining test data from a test performed after inspection, the test data indicative of functional defectivity of the specimen with respect to at least one structural feature at a suspected layer; retrieving inspection data of the suspected layer including a set of inspection images and a set of defect maps of the plurality of processing steps of the suspected layer; correlating the test data and the set of defect maps of the suspected layer to identify one or more structural features of the suspected layer with unmatched defectivity; for each of the identified structural features, including at least part of the inspection images corresponding to the structural feature in a training set; and using the training set to train a machine learning (ML) model in the inspection recipe.
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