公开(公告)号：US20150201504A1

公开(公告)日：2015-07-16

申请号：US14597649

申请日：2015-01-15

Applicant: Applied Nanotech, Inc.

Inventor： ZVI YANIV ,  XUEPING LI ,  JAMES P. NOVAK

IPC: H05K3/38 ,  H05K3/10 ,  H05K3/12

CPC classification number: H05K3/1283 ,  H05K1/097 ,  H05K3/125 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/0224

Abstract: Conductive patterns are formed using formulations containing metallic particles, which may be copper. These metallic particles may be coated with a binder material that improves adhesion during photosintering of the formulations. The binder contains chemistry suitable for it to be removed from the particles in a separate process such as drying or thermal sintering. The coating is a non-volatile organic compound attached to the metallic particles with a minimum thickness oxide coating. The organic coating improves a coefficient of thermal expansion value match between the metallic particles and the substrate, which may be polymeric.

Abstract translation: 使用含有金属颗粒（可以是铜）的配方形成导电图案。 这些金属颗粒可以用粘合剂材料涂覆，该粘合剂材料在制剂的光烧结期间改善粘附性。 粘合剂含有适合于在单独的工艺如干燥或热烧结中从颗粒中除去的化学物质。 涂层是附着在具有最小厚度的氧化物涂层的金属颗粒上的非挥发性有机化合物。 有机涂层改善金属颗粒和基底之间的热膨胀系数匹配，其可以是聚合物。