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公开(公告)号：US11728576B2
公开(公告)日：2023-08-15
申请号：US17663163
申请日：2022-05-12
Applicant: Aptiv Technologies Limited
Inventor： Scott D. Brandenburg , Mark W. Hudson , David W. Zimmerman
CPC classification number: H01Q21/0087 , H01Q1/2283 , H01Q21/005 , H01Q21/0043 , H01Q21/0068
Abstract: This document describes techniques and apparatuses for a plastic air-waveguide antenna with conductive particles. The described antenna includes an antenna body made from a resin embedded with conductive particles, a surface of the antenna body that includes a resin layer with no or fewer conductive particles, and a waveguide structure. The waveguide structure can be made from a portion of the surface on which the embedded conductive particles are exposed. The waveguide structure can be molded as part of the antenna body or cut into the antenna body using a laser, which also exposes the conductive particles. If the waveguide is molded as part of the antenna body, the conductive particles can be exposed by an etching process or by using the laser. In this way, the described apparatuses and techniques can reduce weight, improve gain and phase control, improve high-temperature performance, and avoid at least some vapor-deposition plating operations.
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公开(公告)号：US20210028088A1
公开(公告)日：2021-01-28
申请号：US16520862
申请日：2019-07-24
Applicant: Aptiv Technologies Limited
Inventor： Scott D. Brandenburg , David W. Zimmerman
IPC: H01L23/427 , H01L23/373 , H01L23/42 , H01L23/04 , H01L23/29 , H01L23/498 , H01L23/473 , H01L21/48 , H05K1/02 , H05K1/18
Abstract: An electronic device includes a printed circuit board (PCB) that supports an integrated circuit (IC) chip. The device also includes a lid over the IC chip. A thermal interface material (TIM) is configured to transfer thermal energy from the IC chip to the lid. A heat spreader forms a cavity in communication with the lid. The heat spreader is at least partially filled with a liquid that is configured to change phases during operation of the IC chip.
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公开(公告)号：US20240022001A1
公开(公告)日：2024-01-18
申请号：US17812770
申请日：2022-07-15
Applicant: Aptiv Technologies Limited
CPC classification number: H01Q13/06 , H01Q1/526 , H01Q1/2283 , H05K1/0243 , H05K3/34 , H05K2201/10098
Abstract: Described herein is a waveguide that is configured to be soldered to a printed circuit board (PCB) via one or more metallic portions disposed thereon. Additionally, the waveguide may have solder disposed within thru holes that is configured to conduct heat from one or more components of the PCB when the waveguide is mounted to the PCB. Also described herein is an assembly comprising the waveguide soldered to the PCB via solder between the metallic portions of the waveguide and metallic portions of the PCB. Techniques for producing the waveguide and the assembly are also described herein. By soldering the waveguide to the PCB, an inexpensive, precise, and secure mechanical bonding may be achieved while electrically sealing features of the waveguide and/or components of the PCB. Furthermore, the solder within the thru holes allows for better heat conduction through the waveguide.
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公开(公告)号：US11616306B2
公开(公告)日：2023-03-28
申请号：US17353595
申请日：2021-06-21
Applicant: Aptiv Technologies Limited
Abstract: This document describes a single-layer air waveguide antenna integrated on a circuit board. The waveguide guides electromagnetic energy through channels filled with air. It is formed from a single layer of material, such as a sheet of metal, metal-coated plastic, or other material with conductive surfaces that is attached to a circuit board. A portion of a surface of the circuit board is configured as a floor of the channels filled with air. This floor is an electrical interface between the circuit board and the channels filled with air. The single layer of material is positioned atop this electrical interface to define walls and a ceiling of the channels filled with air. The single layer of material can be secured to the circuit board in various ways. The cost of integrating an air waveguide antenna on to a circuit board this way may be less expensive than other waveguide-manufacturing techniques.
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公开(公告)号：US11315852B2
公开(公告)日：2022-04-26
申请号：US16599712
申请日：2019-10-11
Applicant: APTIV TECHNOLOGIES LIMITED
Inventor： Scott D. Brandenburg , David W. Zimmerman
IPC: H01L23/373 , H01L23/367 , H05K7/20
Abstract: An electronic device includes a printed circuit board that supports an integrated circuit (IC) chip and a thermal interface layer that is configured to transfer thermal energy from the IC chip. The thermal interface layer includes a containment frame that is non-electrically conductive and a thermal conductance pane that is inset in the containment frame.
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Patent Agency Ranking
公开(公告)号：US11121058B2
公开(公告)日：2021-09-14
申请号：US16520862
申请日：2019-07-24
Applicant: Aptiv Technologies Limited
Inventor： Scott D. Brandenburg , David W. Zimmerman
IPC: H01L23/427 , H01L23/373 , H01L23/42 , H01L23/04 , H01L23/29 , H01L23/473 , H01L21/48 , H05K1/02 , H05K1/18 , H01L23/498
Abstract: An electronic device includes a printed circuit board (PCB) that supports an integrated circuit (IC) chip. The device also includes a lid over the IC chip. A thermal interface material (TIM) is configured to transfer thermal energy from the IC chip to the lid. A heat spreader forms a cavity in communication with the lid. The heat spreader is at least partially filled with a liquid that is configured to change phases during operation of the IC chip.
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公开(公告)号：US11095014B2
公开(公告)日：2021-08-17
申请号：US16735884
申请日：2020-01-07
Applicant: Aptiv Technologies Limited
Inventor： Scott D. Brandenburg , David W. Zimmerman , Shawn Shi
Abstract: An illustrative example embodiment of an antenna device includes a substrate, a plurality of antenna elements supported on the substrate, an integrated circuit supported on one side of the substrate, and a metallic waveguide antenna situated against the substrate. The metallic waveguide antenna includes a heat dissipation portion in a thermally conductive relationship with the integrated circuit. The heat dissipation portion is configured to reduce a temperature of the integrated circuit.
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公开(公告)号：US20230352845A1
公开(公告)日：2023-11-02
申请号：US17809116
申请日：2022-06-27
Applicant: Aptiv Technologies Limited
Inventor： Biswadeep Das Gupta , Syed An Nazmus Saqueb , Scott D. Brandenburg , David Wayne Zimmerman , Warren Whithaus
IPC: G01S13/931 , H01Q13/18 , H01Q1/32 , H01Q19/10 , H01Q21/08
CPC classification number: H01Q13/18 , G01S13/931 , H01Q1/3233 , H01Q19/10 , H01Q21/08
Abstract: This document describes techniques, apparatuses, and systems for a waveguide with slot antennas and reflectors. An apparatus may include a waveguide channel that includes a hollow channel containing a dielectric and an array of slot antennas through a surface that is operably connected with the dielectric. The apparatus also includes reflectors positioned adjacent to and offset from each longitudinal side of the waveguide channel. The reflectors and the waveguide channel are positioned to generate a particular radiation pattern for an antenna element electrically coupled to the dielectric. In this way, the described waveguide with slot antennas and reflectors can adjust the positioning of the reflectors to provide a radiation pattern with a wide or asymmetric beamwidth.
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公开(公告)号：US20230208016A1
公开(公告)日：2023-06-29
申请号：US17645796
申请日：2021-12-23
Applicant: Aptiv Technologies Limited
Inventor： Scott D. Brandenburg , David Wayne Zimmerman , Mark William Hudson , Sophie Macfarland , Dennis C. Nohns
CPC classification number: H01Q1/3233 , C09D5/08 , C09D5/24 , H01Q1/02 , H01Q1/38 , H01Q1/40 , H01Q1/526 , H01Q1/2283
Abstract: This document describes techniques, apparatuses, and systems of a metal antenna assembly with integrated features. The described antenna assembly comprises an antenna structure including an antenna body having at least one antenna element formed from a metal alloy while in a thixotropic state. The antenna structure includes a surface having a corrosion inhibitor coating. The antenna assembly further includes an air-waveguide structure. In implementations, the antenna structure is configured to attach to a mounting. The antenna structure includes at least one integrated alignment feature promoting alignment during manufacturing of the antenna assembly. The antenna structure further includes an internal portion in the antenna body defining an integrated heatsink portion and an integrated electromagnetic interference portion within which circuit components can reside. In aspects, using the at least one integrated alignment feature, multiple antenna elements can be assembled or stacked together to form an antenna assembly with complex waveguide patterns.
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公开(公告)号：US11626345B2
公开(公告)日：2023-04-11
申请号：US17403632
申请日：2021-08-16
Applicant: Aptiv Technologies Limited
Inventor： Scott D. Brandenburg , David W. Zimmerman
IPC: H01L23/427 , H01L23/373 , H01L23/42 , H01L23/04 , H01L23/29 , H01L23/473 , H01L21/48 , H05K1/02 , H05K1/18 , H01L23/498
Abstract: An electronic device includes a printed circuit board (PCB) that supports an integrated circuit (IC) chip. The device also includes a lid over the IC chip. A thermal interface material (TIM) is configured to transfer thermal energy from the IC chip to the lid. A heat spreader forms a cavity in communication with the lid. The heat spreader is at least partially filled with a liquid that is configured to change phases during operation of the IC chip.
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