公开(公告)号：US12137515B2

公开(公告)日：2024-11-05

申请号：US17217511

申请日：2021-03-30

Applicant: APTIV TECHNOLOGIES LIMITED

Inventor： Scott D. Brandenburg ,  David W. Zimmerman ,  Navneet Gupta

IPC: H05K1/02 ,  G01S7/02 ,  G01S13/931 ,  H01L23/367 ,  H01L23/552 ,  H05K1/18 ,  H05K3/30 ,  H05K7/20 ,  H05K9/00

Abstract: An electromagnetic interference (EMI) shielding and thermal management system, method, and automotive radar system for an integrated circuit of a product circuit board (PCB) of a radar sensor includes a shield member disposed above the integrated circuit and extending to unpopulated areas of the PCB and configured to shield the integrated circuit from EMI and transfer heat energy generated by the integrated circuit away from the integrated circuit, and a set of pin members configured to be inserted through respective apertures defined by the shield member and the PCB and configured to transfer the heat energy from the shield member to an environment external to the PCB.

公开(公告)号：US20220248525A1

公开(公告)日：2022-08-04

申请号：US17217511

申请日：2021-03-30

Applicant: APTIV TECHNOLOGIES LIMITED

Inventor： Scott D. Brandenburg ,  David W. Zimmerman ,  Navneet Gupta

IPC: H05K1/02 ,  H01L23/552 ,  H01L23/367 ,  H05K1/18 ,  H05K3/30 ,  H05K9/00 ,  H05K7/20 ,  G01S7/02 ,  G01S13/931

Abstract: An electromagnetic interference (EMI) shielding and thermal management system, method, and automotive radar system for an integrated circuit of a product circuit board (PCB) of a radar sensor includes a shield member disposed above the integrated circuit and extending to unpopulated areas of the PCB and configured to shield the integrated circuit from EMI and transfer heat energy generated by the integrated circuit away from the integrated circuit, and a set of pin members configured to be inserted through respective apertures defined by the shield member and the PCB and configured to transfer the heat energy from the shield member to an environment external to the PCB.

公开(公告)号：US20230408636A1

公开(公告)日：2023-12-21

申请号：US17876799

申请日：2022-07-29

Applicant: APTIV TECHNOLOGIES LIMITED

Inventor： Kesav Kumar Sridharan ,  Navneet Gupta ,  Scott Brandenburg ,  David Zimmerman

IPC: G01S7/02 ,  B29C45/14 ,  G01S13/931 ,  H05K7/20

CPC classification number: G01S7/027 ,  B29C45/14467 ,  B29C45/14778 ,  G01S13/931 ,  H05K7/20854 ,  B29K2995/0013 ,  B29L2031/3481

Abstract: Thermal management and shielding techniques for a radar device of a vehicle, the radar device having a radar transceiver circuit and a radar-transmissive radome, include a housing formed of a thermally-conductive plastic material and configured to receive and provide shield grounding to the radar transceiver circuit, and a metal layer applied to an inner surface of the housing to provide for thermal spreading of heat energy generated by the radar transceiver circuit.

公开(公告)号：US11825593B2

公开(公告)日：2023-11-21

申请号：US17701767

申请日：2022-03-23

Applicant: APTIV TECHNOLOGIES LIMITED

Inventor： Navneet Gupta ,  Kesav Kumar Sridharan ,  Scott Brandenburg

IPC: H05K1/02 ,  H05K1/18 ,  H05K1/11 ,  H05K7/20 ,  H01L23/498

CPC classification number: H05K1/0206 ,  H05K1/113 ,  H05K1/181 ,  H05K7/20154 ,  H01L23/49816 ,  H05K2201/066 ,  H05K2201/10378 ,  H05K2201/10734

Abstract: An illustrative example embodiment of an electronic device includes an integrated circuit component having a plurality of solder balls on one side. The substrate includes a first side adjacent the one side of the integrated circuit component. The substrate includes a plurality of openings. At least some of those openings are aligned with the solder balls. A cooling plate is situated toward a second side of the substrate. A thermally conductive material within the plurality of openings is thermally coupled with the cooling plate. At least some of the thermally conductive material is thermally coupled with the solder balls.