公开(公告)号：US20240022001A1

公开(公告)日：2024-01-18

申请号：US17812770

申请日：2022-07-15

Applicant: Aptiv Technologies Limited

Inventor： Scott D. Brandenburg ,  David Wayne Zimmerman ,  Michael J. Pepples ,  Kevin Paul McReynolds

IPC: H01Q13/06 ,  H01Q1/52 ,  H01Q1/22 ,  H05K1/02 ,  H05K3/34

CPC classification number: H01Q13/06 ,  H01Q1/526 ,  H01Q1/2283 ,  H05K1/0243 ,  H05K3/34 ,  H05K2201/10098

Abstract: Described herein is a waveguide that is configured to be soldered to a printed circuit board (PCB) via one or more metallic portions disposed thereon. Additionally, the waveguide may have solder disposed within thru holes that is configured to conduct heat from one or more components of the PCB when the waveguide is mounted to the PCB. Also described herein is an assembly comprising the waveguide soldered to the PCB via solder between the metallic portions of the waveguide and metallic portions of the PCB. Techniques for producing the waveguide and the assembly are also described herein. By soldering the waveguide to the PCB, an inexpensive, precise, and secure mechanical bonding may be achieved while electrically sealing features of the waveguide and/or components of the PCB. Furthermore, the solder within the thru holes allows for better heat conduction through the waveguide.