-
1.发明授权公开(公告)号：US11737203B2
公开(公告)日：2023-08-22
申请号：US17805444
申请日：2022-06-03
Applicant: Aptiv Technologies Limited
Inventor： Scott Brandenburg , David Wayne Zimmerman
CPC classification number: H05K1/0204 , H05K1/0209 , G01S7/027
Abstract: A heatsink shield with thermal-contact dimples can improve thermal-energy distribution in a radar assembly. The radar assembly includes a printed circuit board (PCB), the heatsink shield, a radome, and a housing. The PCB can include integrated circuits and other components, along with a thermally-conductive material that covers at least a portion of the PCB surfaces. The heatsink shield includes multiple dimples that thermally contact the thermally-conductive material. The heatsink shield is configured to distribute thermal energy produced at least in part by the PCB components to the housing. In this way, the described techniques and systems permit the radar assembly to better distribute thermal energy away from the PCB components to the rest of the PCB and through the housing.
-
公开(公告)号：US20230378656A1
公开(公告)日：2023-11-23
申请号：US18163091
申请日：2023-02-01
Applicant: Aptiv Technologies Limited
CPC classification number: H01Q13/22 , H01P3/121 , H01P5/107 , H01Q21/0043 , H01P11/002 , G01S7/032
Abstract: This document describes a single-layer air waveguide antenna integrated on a circuit board. The waveguide guides electromagnetic energy through channels filled with air. It is formed from a single layer of material, such as a sheet of metal, metal-coated plastic, or other material with conductive surfaces that is attached to a circuit board. A portion of a surface of the circuit board is configured as a floor of the channels filled with air. This floor is an electrical interface between the circuit board and the channels filled with air. The single layer of material is positioned atop this electrical interface to define walls and a ceiling of the channels filled with air. The single layer of material can be secured to the circuit board in various ways. The cost of integrating an air waveguide antenna on to a circuit board this way may be less expensive than other waveguide-manufacturing techniques.
-
公开(公告)号：US20220256685A1
公开(公告)日：2022-08-11
申请号：US17306868
申请日：2021-05-03
Applicant: Aptiv Technologies Limited
Inventor： Scott D. Brandenburg , David Wayne Zimmerman
Abstract: Formed waveguide antennas using one or metal sheets can improve the materials and manufacturing process of a radar assembly. For example, the radar system can include a printed circuit board (PCB) and a metal sheet attached to the PCB. The metal sheet can be formed to provide multiple waveguide antennas that each include multiple waveguide channels. Multiple radiation slots can be formed on a surface of each of the multiple waveguide channels. The PCB can include an MIMIC and a thermally conductive material covering a portion of a first and a second surface of the PCB. The metal sheet can also be formed to provide a shield for the MIMIC. In this way, the described techniques and systems permit the waveguide antennas to formed with materials and a manufacturing process that reduce costs while still providing high performance (e.g., minimized loss).
-
公开(公告)号：US20240022001A1
公开(公告)日：2024-01-18
申请号：US17812770
申请日：2022-07-15
Applicant: Aptiv Technologies Limited
CPC classification number: H01Q13/06 , H01Q1/526 , H01Q1/2283 , H05K1/0243 , H05K3/34 , H05K2201/10098
Abstract: Described herein is a waveguide that is configured to be soldered to a printed circuit board (PCB) via one or more metallic portions disposed thereon. Additionally, the waveguide may have solder disposed within thru holes that is configured to conduct heat from one or more components of the PCB when the waveguide is mounted to the PCB. Also described herein is an assembly comprising the waveguide soldered to the PCB via solder between the metallic portions of the waveguide and metallic portions of the PCB. Techniques for producing the waveguide and the assembly are also described herein. By soldering the waveguide to the PCB, an inexpensive, precise, and secure mechanical bonding may be achieved while electrically sealing features of the waveguide and/or components of the PCB. Furthermore, the solder within the thru holes allows for better heat conduction through the waveguide.
-
公开(公告)号：US11616306B2
公开(公告)日：2023-03-28
申请号：US17353595
申请日：2021-06-21
Applicant: Aptiv Technologies Limited
Abstract: This document describes a single-layer air waveguide antenna integrated on a circuit board. The waveguide guides electromagnetic energy through channels filled with air. It is formed from a single layer of material, such as a sheet of metal, metal-coated plastic, or other material with conductive surfaces that is attached to a circuit board. A portion of a surface of the circuit board is configured as a floor of the channels filled with air. This floor is an electrical interface between the circuit board and the channels filled with air. The single layer of material is positioned atop this electrical interface to define walls and a ceiling of the channels filled with air. The single layer of material can be secured to the circuit board in various ways. The cost of integrating an air waveguide antenna on to a circuit board this way may be less expensive than other waveguide-manufacturing techniques.
-
Patent Agency Ranking
公开(公告)号：US20220352640A1
公开(公告)日：2022-11-03
申请号：US17323877
申请日：2021-05-18
Applicant: Aptiv Technologies Limited
Inventor： Scott D. Brandenburg , David Wayne Zimmerman , Mark William Hudson
Abstract: This document describes techniques, apparatuses, and systems for a multi-layer air waveguide with layer-to-layer connections. Each pre-formed layer of the air waveguide is attached to at least one other pre-formed layer by a mechanical interface. The mechanical interface may be a stud-based interface, a snap fastener-based interface, a ball-and-socket based interface, or a pressure contact interface utilizing irregular roughed surfaces of each pre-formed layer. The mechanical interfaces of the pre-formed layers structurally hold the air waveguide together and electrically couple all of the pre-formed layers. In this manner, the cost of manufacturing the air waveguide antennas may be less expensive than previous manufacturing processes.
-
7.发明申请公开(公告)号：US20220304139A1
公开(公告)日：2022-09-22
申请号：US17805444
申请日：2022-06-03
Applicant: Aptiv Technologies Limited
Inventor： Scott Brandenburg , David Wayne Zimmerman
IPC: H05K1/02
Abstract: A heatsink shield with thermal-contact dimples can improve thermal-energy distribution in a radar assembly. The radar assembly includes a printed circuit board (PCB), the heatsink shield, a radome, and a housing. The PCB can include integrated circuits and other components, along with a thermally-conductive material that covers at least a portion of the PCB surfaces. The heatsink shield includes multiple dimples that thermally contact the thermally-conductive material. The heatsink shield is configured to distribute thermal energy produced at least in part by the PCB components to the housing. In this way, the described techniques and systems permit the radar assembly to better distribute thermal energy away from the PCB components to the rest of the PCB and through the housing.
-
8.发明授权公开(公告)号：US11382205B2
公开(公告)日：2022-07-05
申请号：US17023258
申请日：2020-09-16
Applicant: Aptiv Technologies Limited
Inventor： Scott Brandenburg , David Wayne Zimmerman
IPC: H05K1/02 , G01S7/02 , G01S13/931
Abstract: A heatsink shield with thermal-contact dimples can improve thermal-energy distribution in a radar assembly. The radar assembly includes a printed circuit board (PCB), the heatsink shield, a radome, and a housing. The PCB can include integrated circuits and other components, along with a thermally-conductive material that covers at least a portion of the PCB surfaces. The heatsink shield includes multiple dimples that thermally contact the thermally-conductive material. The heatsink shield is configured to distribute thermal energy produced at least in part by the PCB components to the housing. In this way, the described techniques and systems permit the radar assembly to better distribute thermal energy away from the PCB components to the rest of the PCB and through the housing.
-
公开(公告)号：US20230352845A1
公开(公告)日：2023-11-02
申请号：US17809116
申请日：2022-06-27
Applicant: Aptiv Technologies Limited
Inventor： Biswadeep Das Gupta , Syed An Nazmus Saqueb , Scott D. Brandenburg , David Wayne Zimmerman , Warren Whithaus
IPC: G01S13/931 , H01Q13/18 , H01Q1/32 , H01Q19/10 , H01Q21/08
CPC classification number: H01Q13/18 , G01S13/931 , H01Q1/3233 , H01Q19/10 , H01Q21/08
Abstract: This document describes techniques, apparatuses, and systems for a waveguide with slot antennas and reflectors. An apparatus may include a waveguide channel that includes a hollow channel containing a dielectric and an array of slot antennas through a surface that is operably connected with the dielectric. The apparatus also includes reflectors positioned adjacent to and offset from each longitudinal side of the waveguide channel. The reflectors and the waveguide channel are positioned to generate a particular radiation pattern for an antenna element electrically coupled to the dielectric. In this way, the described waveguide with slot antennas and reflectors can adjust the positioning of the reflectors to provide a radiation pattern with a wide or asymmetric beamwidth.
-
公开(公告)号：US20230208016A1
公开(公告)日：2023-06-29
申请号：US17645796
申请日：2021-12-23
Applicant: Aptiv Technologies Limited
Inventor： Scott D. Brandenburg , David Wayne Zimmerman , Mark William Hudson , Sophie Macfarland , Dennis C. Nohns
CPC classification number: H01Q1/3233 , C09D5/08 , C09D5/24 , H01Q1/02 , H01Q1/38 , H01Q1/40 , H01Q1/526 , H01Q1/2283
Abstract: This document describes techniques, apparatuses, and systems of a metal antenna assembly with integrated features. The described antenna assembly comprises an antenna structure including an antenna body having at least one antenna element formed from a metal alloy while in a thixotropic state. The antenna structure includes a surface having a corrosion inhibitor coating. The antenna assembly further includes an air-waveguide structure. In implementations, the antenna structure is configured to attach to a mounting. The antenna structure includes at least one integrated alignment feature promoting alignment during manufacturing of the antenna assembly. The antenna structure further includes an internal portion in the antenna body defining an integrated heatsink portion and an integrated electromagnetic interference portion within which circuit components can reside. In aspects, using the at least one integrated alignment feature, multiple antenna elements can be assembled or stacked together to form an antenna assembly with complex waveguide patterns.
-
-
-
-
-
-
-
-
-
Search Results
12
records
(took 0.02 seconds)
