公开(公告)号：US20210375652A1

公开(公告)日：2021-12-02

申请号：US17400003

申请日：2021-08-11

Applicant: Areesys Technologies, Inc.

Inventor： Hongwei Lu ,  Daliang Wang ,  Albert Ting ,  Efrain Velazquez ,  Xiaoyan Zhang ,  Kai-An Wang

IPC: H01L21/677 ,  H01L29/08

Abstract: A poling apparatus for poling a polymer thin film formed on a workpiece carried by a workpiece carrier. The workpiece has grounding electrodes and grounding pads located at edges, and a thin film covering the grounding electrodes but exposing the grounding pads. The workpiece carrier has carrier electrodes located around the workpiece and inside grounding ports at the bottom. The poling apparatus includes, in a poling chamber, a poling source generating a plasma, a Z-elevator to raise the workpiece carrier toward the poling source using the grounding ports, and grounding mechanisms including downwardly biased electrical contacts which, when the workpiece carrier is raised by the Z-elevator, connect the grounding pads of the workpiece with the carrier electrodes, to ground the workpiece. The poling apparatus additionally includes preparation platform and transfer platform with conveyer systems with rollers and Z-elevators to move the workpiece carrier in and out of the poling chamber.

公开(公告)号：US11830748B2

公开(公告)日：2023-11-28

申请号：US17400003

申请日：2021-08-11

Applicant: Areesys Technologies, Inc.

Inventor： Hongwei Lu ,  Daliang Wang ,  Albert Ting ,  Efrain Velazquez ,  Xiaoyan Zhang ,  Kai-An Wang

IPC: H01L21/677 ,  H01L29/08 ,  C08L27/16

CPC classification number: H01L21/67703 ,  H01L29/08 ,  C08L27/16

Abstract: A poling apparatus for poling a polymer thin film formed on a workpiece carried by a workpiece carrier. The workpiece has grounding electrodes and grounding pads located at edges, and a thin film covering the grounding electrodes but exposing the grounding pads. The workpiece carrier has carrier electrodes located around the workpiece and inside grounding ports at the bottom. The poling apparatus includes, in a poling chamber, a poling source generating a plasma, a Z-elevator to raise the workpiece carrier toward the poling source using the grounding ports, and grounding mechanisms including downwardly biased electrical contacts which, when the workpiece carrier is raised by the Z-elevator, connect the grounding pads of the workpiece with the carrier electrodes, to ground the workpiece. The poling apparatus additionally includes preparation platform and transfer platform with conveyer systems with rollers and Z-elevators to move the workpiece carrier in and out of the poling chamber.

公开(公告)号：US11282729B2

公开(公告)日：2022-03-22

申请号：US16728472

申请日：2019-12-27

Applicant: Areesys Technologies, Inc.

Inventor： Hongwei Lu ,  Daliang Wang ,  Albert Ting ,  Efrain Velazquez ,  Xiaoyan Zhang ,  Kai-An Wang

IPC: C08L27/16 ,  H01L21/677 ,  H01L29/08

Abstract: A poling apparatus for poling a polymer thin film formed on a workpiece carried by a workpiece carrier. The workpiece has grounding electrodes and grounding pads located at edges, and a thin film covering the grounding electrodes but exposing the grounding pads. The workpiece carrier has carrier electrodes located around the workpiece and inside grounding ports at the bottom. The poling apparatus includes, in a poling chamber, a poling source generating a plasma, a Z-elevator to raise the workpiece carrier toward the poling source using the grounding ports, and grounding mechanisms including downwardly biased electrical contacts which, when the workpiece carrier is raised by the Z-elevator, connect the grounding pads of the workpiece with the carrier electrodes, to ground the workpiece. The poling apparatus additionally includes preparation platform and transfer platform with conveyer systems with rollers and Z-elevators to move the workpiece carrier in and out of the poling chamber.

公开(公告)号：US20200211878A1

公开(公告)日：2020-07-02

申请号：US16728472

申请日：2019-12-27

Applicant: Areesys Technologies, Inc.

Inventor： Hongwei Lu ,  Daliang Wang ,  Albert Ting ,  Efrain Velazquez ,  Xiaoyan Zhang ,  Kai-An Wang

IPC: H01L21/677 ,  H01L29/08

Abstract: A poling apparatus for poling a polymer thin film formed on a workpiece carried by a workpiece carrier. The workpiece has grounding electrodes and grounding pads located at edges, and a thin film covering the grounding electrodes but exposing the grounding pads. The workpiece carrier has carrier electrodes located around the workpiece and inside grounding ports at the bottom. The poling apparatus includes, in a poling chamber, a poling source generating a plasma, a Z-elevator to raise the workpiece carrier toward the poling source using the grounding ports, and grounding mechanisms including downwardly biased electrical contacts which, when the workpiece carrier is raised by the Z-elevator, connect the grounding pads of the workpiece with the carrier electrodes, to ground the workpiece. The poling apparatus additionally includes preparation platform and transfer platform with conveyer systems with rollers and Z-elevators to move the workpiece carrier in and out of the poling chamber.