公开(公告)号：US20210375652A1

公开(公告)日：2021-12-02

申请号：US17400003

申请日：2021-08-11

Applicant: Areesys Technologies, Inc.

Inventor： Hongwei Lu ,  Daliang Wang ,  Albert Ting ,  Efrain Velazquez ,  Xiaoyan Zhang ,  Kai-An Wang

IPC: H01L21/677 ,  H01L29/08

Abstract: A poling apparatus for poling a polymer thin film formed on a workpiece carried by a workpiece carrier. The workpiece has grounding electrodes and grounding pads located at edges, and a thin film covering the grounding electrodes but exposing the grounding pads. The workpiece carrier has carrier electrodes located around the workpiece and inside grounding ports at the bottom. The poling apparatus includes, in a poling chamber, a poling source generating a plasma, a Z-elevator to raise the workpiece carrier toward the poling source using the grounding ports, and grounding mechanisms including downwardly biased electrical contacts which, when the workpiece carrier is raised by the Z-elevator, connect the grounding pads of the workpiece with the carrier electrodes, to ground the workpiece. The poling apparatus additionally includes preparation platform and transfer platform with conveyer systems with rollers and Z-elevators to move the workpiece carrier in and out of the poling chamber.

公开(公告)号：US11282729B2

公开(公告)日：2022-03-22

申请号：US16728472

申请日：2019-12-27

Applicant: Areesys Technologies, Inc.

Inventor： Hongwei Lu ,  Daliang Wang ,  Albert Ting ,  Efrain Velazquez ,  Xiaoyan Zhang ,  Kai-An Wang

IPC: C08L27/16 ,  H01L21/677 ,  H01L29/08

Abstract: A poling apparatus for poling a polymer thin film formed on a workpiece carried by a workpiece carrier. The workpiece has grounding electrodes and grounding pads located at edges, and a thin film covering the grounding electrodes but exposing the grounding pads. The workpiece carrier has carrier electrodes located around the workpiece and inside grounding ports at the bottom. The poling apparatus includes, in a poling chamber, a poling source generating a plasma, a Z-elevator to raise the workpiece carrier toward the poling source using the grounding ports, and grounding mechanisms including downwardly biased electrical contacts which, when the workpiece carrier is raised by the Z-elevator, connect the grounding pads of the workpiece with the carrier electrodes, to ground the workpiece. The poling apparatus additionally includes preparation platform and transfer platform with conveyer systems with rollers and Z-elevators to move the workpiece carrier in and out of the poling chamber.

公开(公告)号：US11283004B2

公开(公告)日：2022-03-22

申请号：US16865412

申请日：2020-05-03

Applicant: Areesys Technologies, Inc.

Inventor： Albert Ting ,  Hongwei Lu ,  Kai-An Wang

IPC: H01J37/32 ,  H01L41/257 ,  H01L41/193

Abstract: A poling apparatus for poling a polymer thin film formed on a workpiece carried by a workpiece carrier. The workpiece has multiple grounding electrodes, grounding pads located at its edges, and a polymer thin film including multiple areas each covering only one grounding electrode. The poling apparatus includes, in a poling chamber, a poling source generating a plasma, a shadow mask below the poling source, and a Z-elevator to raise the workpiece carrier toward the shadow mask and poling source. When the workpiece in the workpiece carrier is raised to contact the underside of the shadow mask, multiple openings of the shadow mask expose only the corresponding multiple thin film areas of the workpiece to the plasma; meanwhile, conductive grounding terminals on the underside of the shadow mask electrically connect the grounding pads of the workpiece with carrier electrodes on the workpiece carrier, to ground the workpiece.

公开(公告)号：US10050419B2

公开(公告)日：2018-08-14

申请号：US15333218

申请日：2016-10-25

Applicant: Areesys Technologies, Inc.

Inventor： Kai-An Wang ,  Efrain A. Velazquez ,  Craig W. Marion ,  Michael Z. Wong ,  Albert Ting ,  Wen-Chieh Geoffrey Lee

IPC: H01T19/04

Abstract: A corona polarization (also denoted “poling”) process and associated apparatus polarizes a ferroelectric polymer thin film while monitoring and evaluating a substrate current whose magnitude, slope and noise profile (Barkhausen noise) varies in accordance with phase transformation processes of crystallites within the film and, thereby, provides an indication of the polarization status. The electric current flowing through the microstructures of the thin film can be modeled by an equivalent circuit, within which electrical charges stored in the respective microstructures are denoted by a plurality of discrete components (e.g., capacitors). Alternatively, the process can be modeled in terms of a hysteresis loop of polarization vs. electric field, corresponding to the availability of recombination sites on the thin-film surface. By comparing the measured substrate current to the result derived from the equivalent circuit, the major processing parameters such as poling current and voltage can be adjusted via an in-situ manner throughout the corona poling process and an accurate process endpoint can be established. As a consequence, a ferroelectric thin film is fabricated that has an enhanced piezoelectric effect yet minimized aging problems.

公开(公告)号：US20140251799A1

公开(公告)日：2014-09-11

申请号：US14188689

申请日：2014-02-25

Applicant: Areesys Technologies, Inc.

Inventor： Kai-An Wang ,  Craig W. Marion ,  Efrain A. Velazquez ,  Michael Z. Wong ,  Albert Ting ,  Jingru Sun

IPC: H01J37/32

CPC classification number: C23C14/35 ,  H01J37/3408 ,  H01J37/3414 ,  H01J37/3417 ,  H01J37/3435 ,  H01J37/345

Abstract: A deposition system includes a magnetron sputter deposition source that includes a backing frame that includes a window and a closed loop around the window. The backing frame includes inside surfaces towards the window, one or more sputtering targets mounted on inside surfaces of the backing frame, and one or more magnets mounted on outside surfaces of the backing frame. The one or more sputtering targets include sputtering surfaces that define internal walls of the window. The one or more magnets can produce a magnetic field near the one or more sputtering surfaces. A substrate includes a deposition surface oriented towards the window in the backing frame. The deposition surface receives sputtering material(s) from the one or more sputtering targets.

Abstract translation: 沉积系统包括磁控溅射沉积源，其包括包括窗口和围绕窗口的闭环的背衬框架。 背衬框架包括朝向窗口的内表面，安装在背衬框架的内表面上的一个或多个溅射靶，以及安装在背衬框架的外表面上的一个或多个磁体。 一个或多个溅射靶包括限定窗的内壁的溅射表面。 一个或多个磁体可以在一个或多个溅射表面附近产生磁场。 衬底包括朝向背衬框架中的窗口定向的沉积表面。 沉积表面接收来自一个或多个溅射靶的溅射材料。

公开(公告)号：US11830748B2

公开(公告)日：2023-11-28

申请号：US17400003

申请日：2021-08-11

Applicant: Areesys Technologies, Inc.

Inventor： Hongwei Lu ,  Daliang Wang ,  Albert Ting ,  Efrain Velazquez ,  Xiaoyan Zhang ,  Kai-An Wang

IPC: H01L21/677 ,  H01L29/08 ,  C08L27/16

CPC classification number: H01L21/67703 ,  H01L29/08 ,  C08L27/16

Abstract: A poling apparatus for poling a polymer thin film formed on a workpiece carried by a workpiece carrier. The workpiece has grounding electrodes and grounding pads located at edges, and a thin film covering the grounding electrodes but exposing the grounding pads. The workpiece carrier has carrier electrodes located around the workpiece and inside grounding ports at the bottom. The poling apparatus includes, in a poling chamber, a poling source generating a plasma, a Z-elevator to raise the workpiece carrier toward the poling source using the grounding ports, and grounding mechanisms including downwardly biased electrical contacts which, when the workpiece carrier is raised by the Z-elevator, connect the grounding pads of the workpiece with the carrier electrodes, to ground the workpiece. The poling apparatus additionally includes preparation platform and transfer platform with conveyer systems with rollers and Z-elevators to move the workpiece carrier in and out of the poling chamber.

公开(公告)号：US20200266332A1

公开(公告)日：2020-08-20

申请号：US16865412

申请日：2020-05-03

Applicant: Areesys Technologies, Inc.

Inventor： Albert Ting ,  Hongwei Lu ,  Kai-An Wang

IPC: H01L41/257 ,  H01J37/32

Abstract: A poling apparatus for poling a polymer thin film formed on a workpiece carried by a workpiece carrier. The workpiece has multiple grounding electrodes, grounding pads located at its edges, and a polymer thin film including multiple areas each covering only one grounding electrode. The poling apparatus includes, in a poling chamber, a poling source generating a plasma, a shadow mask below the poling source, and a Z-elevator to raise the workpiece carrier toward the shadow mask and poling source. When the workpiece in the workpiece carrier is raised to contact the underside of the shadow mask, multiple openings of the shadow mask expose only the corresponding multiple thin film areas of the workpiece to the plasma; meanwhile, conductive grounding terminals on the underside of the shadow mask electrically connect the grounding pads of the workpiece with carrier electrodes on the workpiece carrier, to ground the workpiece.

公开(公告)号：US20210376223A1

公开(公告)日：2021-12-02

申请号：US17400039

申请日：2021-08-11

Applicant: Areesys Technologies, Inc.

Inventor： Albert Ting ,  Hongwei Lu ,  Kai-An Wang

IPC: H01L41/257 ,  H01J37/32

Abstract: A poling apparatus for poling a polymer thin film formed on a workpiece carried by a workpiece carrier. The workpiece has multiple grounding electrodes, grounding pads located at its edges, and a polymer thin film including multiple areas each covering only one grounding electrode. The poling apparatus includes, in a poling chamber, a poling source generating a plasma, a shadow mask below the poling source, and a Z-elevator to raise the workpiece carrier toward the shadow mask and poling source. When the workpiece in the workpiece carrier is raised to contact the underside of the shadow mask, multiple openings of the shadow mask expose only the corresponding multiple thin film areas of the workpiece to the plasma; meanwhile, conductive grounding terminals on the underside of the shadow mask electrically connect the grounding pads of the workpiece with carrier electrodes on the workpiece carrier, to ground the workpiece.

公开(公告)号：US20200211878A1

公开(公告)日：2020-07-02

申请号：US16728472

申请日：2019-12-27

Applicant: Areesys Technologies, Inc.

Inventor： Hongwei Lu ,  Daliang Wang ,  Albert Ting ,  Efrain Velazquez ,  Xiaoyan Zhang ,  Kai-An Wang

IPC: H01L21/677 ,  H01L29/08

Abstract: A poling apparatus for poling a polymer thin film formed on a workpiece carried by a workpiece carrier. The workpiece has grounding electrodes and grounding pads located at edges, and a thin film covering the grounding electrodes but exposing the grounding pads. The workpiece carrier has carrier electrodes located around the workpiece and inside grounding ports at the bottom. The poling apparatus includes, in a poling chamber, a poling source generating a plasma, a Z-elevator to raise the workpiece carrier toward the poling source using the grounding ports, and grounding mechanisms including downwardly biased electrical contacts which, when the workpiece carrier is raised by the Z-elevator, connect the grounding pads of the workpiece with the carrier electrodes, to ground the workpiece. The poling apparatus additionally includes preparation platform and transfer platform with conveyer systems with rollers and Z-elevators to move the workpiece carrier in and out of the poling chamber.

公开(公告)号：US20170310087A1

公开(公告)日：2017-10-26

申请号：US15333218

申请日：2016-10-25

Applicant: Areesys Technologies, Inc.

Inventor： Kai-An Wang ,  Efrain A. Velazquez ,  Craig W. Marion ,  Michael Z. Wong ,  Albert Ting ,  Wen-Chieh Geoffrey Lee

IPC: H01T19/04

CPC classification number: H01T19/04

Abstract: A corona polarization (also denoted “poling”) process and associated apparatus polarizes a ferroelectric polymer thin film while monitoring and evaluating a substrate current whose magnitude, slope and noise profile (Barkhausen noise) varies in accordance with phase transformation processes of crystallites within the film and, thereby, provides an indication of the polarization status. The electric current flowing through the microstructures of the thin film can be modeled by an equivalent circuit, within which electrical charges stored in the respective microstructures are denoted by a plurality of discrete components (e.g., capacitors). Alternatively, the process can be modeled in terms of a hysteresis loop of polarization vs. electric field, corresponding to the availability of recombination sites on the thin-film surface. By comparing the measured substrate current to the result derived from the equivalent circuit, the major processing parameters such as poling current and voltage can be adjusted via an in-situ manner throughout the corona poling process and an accurate process endpoint can be established. As a consequence, a ferroelectric thin film is fabricated that has an enhanced piezoelectric effect yet minimized aging problems.