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公开(公告)号:US07439607B2
公开(公告)日:2008-10-21
申请号:US11246298
申请日:2005-10-11
IPC分类号: H01L27/082
CPC分类号: H01L21/31662 , H01L21/02238 , H01L21/02255 , H01L21/32055 , H01L29/66272 , Y10S438/981
摘要: A method of forming semiconductor device treating a surface of a substrate to produce a discontinuous growth of a material on the surface through rapid thermal oxidation of the substrate surface at a temperature of less than about 700° C.
摘要翻译: 一种形成半导体器件的方法,所述半导体器件通过在小于约700℃的温度下快速热氧化衬底表面来处理衬底的表面以产生表面上材料的不连续生长。
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公开(公告)号:US06984593B2
公开(公告)日:2006-01-10
申请号:US10653912
申请日:2003-09-04
IPC分类号: H01L21/31 , H01L21/469
CPC分类号: H01L21/31662 , H01L21/02238 , H01L21/02255 , H01L21/32055 , H01L29/66272 , Y10S438/981
摘要: A method of forming semiconductor device treating a surface of a substrate to produce a discontinuous growth of a material on the surface through rapid thermal oxidation of the substrate surface at a temperature of less than about 700° C.
摘要翻译: 一种形成半导体器件的方法,所述半导体器件通过在小于约700℃的温度下快速热氧化衬底表面来处理衬底的表面以产生表面上材料的不连续生长。
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