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1.发明授权公开(公告)号：US08747052B2
公开(公告)日：2014-06-10
申请号：US11827165
申请日：2007-07-10
IPC分类号： B66C17/08
CPC分类号： H01L21/67757
摘要： An embodiment of the present invention is a technique to automate transfer of parts for high throughput. A boat transfer unit (BTU) arm carrying a boat containing a plurality of parts is rotated from an initial position to a first position that is below a process chamber. The BTU arm engages a boat support that supports the boat. The BTU arm is moved upward to a second position such that the boat partially enters the process chamber at a distance D with respect to an entrance opening of the process chamber. An elevator arm carrying a pedestal is engaged to lower side of the boat support. The BTU arm is moved away from the second position. The elevator arm is moved upward to fully insert the boat inside the process chamber.
摘要翻译： 本发明的一个实施例是用于自动化用于高通量的部件的传送的技术。 携带包含多个部件的船的船传送单元（BTU）臂从初始位置旋转到处理室下方的第一位置。 BTU手臂接合支撑船的船支架。 BTU臂向上移动到第二位置，使得船相对于处理室的入口以距离D部分地进入处理室。 携带基座的电梯臂接合到船体支撑件的下侧。 BTU臂从第二个位置移开。 电梯臂向上移动以将船完全插入处理室内。
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2.发明申请Monitoring heater condition to predict or detect failure of a heating element 审中-公开监控加热器状态以预测或检测加热元件的故障公开(公告)号：US20080183404A1
公开(公告)日：2008-07-31
申请号：US12008597
申请日：2008-01-11
CPC分类号： G01R31/024
摘要： An embodiment of the invention is a technique to generate warning of a failure of a heating element. An operational value of at least one of operating parameters of the heating element in a heater zone of a heating unit is monitored. A remaining life value of the at least one of the operating parameters is estimated. A warning is generated if the operational value exceeds a threshold value relative to the remaining life value.
摘要翻译： 本发明的实施例是产生加热元件故障的警告的技术。 监视加热单元的加热器区域中的加热元件的操作参数中的至少一个的操作值。 估计所述至少一个操作参数的剩余寿命值。 如果操作值超过相对于剩余寿命值的阈值，则产生警告。
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3.发明申请公开(公告)号：US20080118333A1
公开(公告)日：2008-05-22
申请号：US11827165
申请日：2007-07-10
IPC分类号： H01L21/677
CPC分类号： H01L21/67757
摘要： An embodiment of the present invention is a technique to automate transfer of parts for high throughput. A boat transfer unit (BTU) arm carrying a boat containing a plurality of parts is rotated from an initial position to a first position that is below a process chamber. The BTU arm engages a boat support that supports the boat. The BTU arm is moved upward to a second position such that the boat partially enters the process chamber at a distance D with respect to an entrance opening of the process chamber. An elevator arm carrying a pedestal is engaged to lower side of the boat support. The BTU arm is moved away from the second position. The elevator arm is moved upward to fully insert the boat inside the process chamber.
摘要翻译： 本发明的一个实施例是用于自动化用于高通量的部件的传送的技术。 携带包含多个部件的船的船只传送单元（BTU）臂从初始位置旋转到处理室下方的第一位置。 BTU手臂接合支撑船的船支架。 BTU臂向上移动到第二位置，使得船相对于处理室的入口以距离D部分地进入处理室。 携带基座的电梯臂接合到船体支撑件的下侧。 BTU臂从第二个位置移开。 电梯臂向上移动以将船完全插入处理室内。
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4.发明申请公开(公告)号：US20120061377A1
公开(公告)日：2012-03-15
申请号：US13230839
申请日：2011-09-12
申请人： Mitch Agamohamadi , Saeed Sedehi
发明人： Mitch Agamohamadi , Saeed Sedehi
IPC分类号： H05B3/68
CPC分类号： H01L21/67098
摘要： A thermal processing apparatus is disclosed which separates the load bearing components from the thermal components, improving heating time, cooling time, thermal response, and energy efficiency. The thermal processing apparatus comprises an array of cylindrical heating elements which rest on support plates of high temperature, low density material. The support plates and heating elements are then supported by a rigid skeletal structure for load bearing support.
摘要翻译： 公开了一种热加工装置，其将负载部件与热部件分离，提高加热时间，冷却时间，热响应和能量效率。 该热处理装置包括一组圆柱形加热元件，该阵列放置在高温低密度材料的支撑板上。 然后支撑板和加热元件由用于承载支撑的刚性骨架结构支撑。
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5.发明申请Heating element structure with efficient heat generation and mechanical stability 审中-公开加热元件结构具有高效的发热和机械稳定性公开(公告)号：US20060193366A1
公开(公告)日：2006-08-31
申请号：US11338132
申请日：2006-01-23
申请人： Arsalan Emami , Mitch Agamohamadi , Saeed Sedehi
发明人： Arsalan Emami , Mitch Agamohamadi , Saeed Sedehi
IPC分类号： H05B3/62
CPC分类号： H01C3/20 , H05B3/62 , H05B2203/014
摘要： An embodiment of the present invention is a heating element structure. A first tray has an inner boundary and an outer boundary. The inner and outer boundaries define a space. A first heating element fit to the first tray and surrounding the inner boundary generates heat when power is applied. The heating element expands in the space within a temperature range.
摘要翻译： 本发明的实施例是加热元件结构。 第一托盘具有内边界和外边界。 内部和外部边界定义一个空间。 第一加热元件适合于第一托盘并围绕内边界，在施加电力时产生热量。 加热元件在空间内在温度范围内膨胀。
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公开(公告)号：US20070045279A1
公开(公告)日：2007-03-01
申请号：US11512007
申请日：2006-08-28
申请人： Arsalan Emami , Mitch Agamohamadi , Saeed Sedehi
发明人： Arsalan Emami , Mitch Agamohamadi , Saeed Sedehi
IPC分类号： H05B3/68
摘要： An embodiment of the present invention is a heating element structure. A first strip wire shaped in a wave-like configuration is attached to an insulator surface by a plurality of staples placed along the first strip wire.
摘要翻译： 本发明的实施例是加热元件结构。 通过沿着第一带状线布置的多个钉将一个波状构造的第一带状线连接到绝缘体表面。
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公开(公告)号：US06492621B2
公开(公告)日：2002-12-10
申请号：US09934952
申请日：2001-08-21
IPC分类号： F27B514
CPC分类号： C23C16/463 , C23C16/455 , C23C16/4584 , C30B25/10 , C30B25/14 , F27B5/14 , F27B2005/161 , F27D1/1858 , F27D2003/0075 , H01L21/67109
摘要： An apparatus for heat treatment of a wafer is disclosed. The apparatus includes a heating chamber having a heat source. A cooling chamber is positioned adjacent to the heating chamber and includes a cooling source. A wafer holder is configured to move between the cooling chamber and the heating chamber through a passageway and one or more shutters defines the size of the passageway. The one or more shutters are movable between an open position where the wafer holder can pass through the passageway and an obstructing position which defines a passageway which is smaller than the passageway defined when the shutter is in the open position.
摘要翻译： 公开了一种用于晶片热处理的设备。 该装置包括具有热源的加热室。 冷却室位于加热室附近并且包括冷却源。 晶片保持器构造成通过通道在冷却室和加热室之间移动，并且一个或多个快门限定通道的尺寸。 一个或多个百叶窗可以在晶片保持器可以穿过通道的打开位置和限定通道的阻塞位置之间移动，该通道小于当快门处于打开位置时限定的通道。
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公开(公告)号：US06300600B1
公开(公告)日：2001-10-09
申请号：US09373894
申请日：1999-08-12
IPC分类号： F27B514
CPC分类号： C23C16/463 , C23C16/455 , C23C16/4584 , C30B25/10 , C30B25/14 , F27B5/14 , F27B2005/161 , F27D1/1858 , F27D2003/0075 , H01L21/67109
摘要： An apparatus for heat treatment of a wafer is disclosed. The apparatus includes a heating chamber having a heat source. A cooling chamber is positioned adjacent to the heating chamber and includes a cooling source. A wafer holder is configured to move between the cooling chamber and the heating chamber through a passageway and one or more shutters defines the size of the passageway. The one or more shutters are movable between an open position where the wafer holder can pass through the passageway and an obstructing position which defines a passageway which is smaller than the passageway defined when the shutter is in the open position.
摘要翻译： 公开了一种用于晶片热处理的设备。 该装置包括具有热源的加热室。 冷却室位于加热室附近并且包括冷却源。 晶片保持器构造成通过通道在冷却室和加热室之间移动，并且一个或多个快门限定通道的尺寸。 一个或多个百叶窗可以在晶片保持器可以穿过通道的打开位置和限定通道的阻塞位置之间移动，该通道小于当快门处于打开位置时所限定的通道。
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