公开(公告)号：US11443969B2

公开(公告)日：2022-09-13

申请号：US16489392

申请日：2018-02-19

Applicant: Atotech Deutschland GmbH

Inventor： Rüdiger Pretscher ,  Daniel Buchberger

IPC: H01L21/677 ,  B65G47/91 ,  C25D17/06 ,  H01L21/67 ,  H01L21/683 ,  H01L21/687 ,  H02K7/116 ,  H02K37/24

Abstract: The present invention refers to a substrate holder loading device to be used in a clean room and a clean room treatment device containing such substrate holder loading device. Furthermore, the present invention refers to a method of loading a substrate holder with a first substrate, more preferably with a first and a second substrate.

公开(公告)号：US10832929B2

公开(公告)日：2020-11-10

申请号：US16326404

申请日：2017-09-14

Applicant: Atotech Deutschland GmbH

Inventor： Ralph Rauenbusch ,  Tobias Bussenius ,  Daniel Buchberger ,  Ray Weinhold

IPC: H01L21/677 ,  C25F1/00 ,  H01L21/683 ,  H01L21/67

Abstract: The present invention refers to a method for processing a wafer like substrate using a touching gripper and a touchless gripper. Furthermore, the present invention refers to an apparatus for processing a wafer-like substrate containing a touching gripper and a touchless gripper. Additionally, the present invention refers to the use of an inventive apparatus to process a wafer-like substrate.