公开(公告)号：US09783891B2

公开(公告)日：2017-10-10

申请号：US15127036

申请日：2015-03-17

申请人： Atotech Deutschland GmbH

发明人： Jacob Blickensderfer ,  Rohan Akolkar ,  Paige Altemare ,  Kay-Oliver Thiel ,  Hans-Jürgen Schreier

IPC分类号： C23C18/50 ,  C23C18/16

CPC分类号： C23C18/50 ,  C23C18/1633 ,  C23C18/1675 ,  C23C18/1682

摘要： An aqueous plating bath for the electroless deposition of iron boron alloy coatings, characterized in that it comprises at least one iron ion source, at least one boron based reducing agent, at least one complexing agent, at least one pH buffer and at least one base wherein its pH value is 11 or higher and the molar ratio of the boron based reducing agents in relation to the iron ions in the aqueous plating bath is at least 6:1. Also, a process for the use of said aqueous plating bath is disclosed. The aqueous plating bath according to the invention shows good stability and plating rate and yields glossy and homogeneous iron boron alloy coatings on various substrates. It is an advantage of the plating bath that it does not require any sacrificial anodes.