公开(公告)号：US10077498B2

公开(公告)日：2018-09-18

申请号：US14906370

申请日：2014-09-11

申请人： Atotech Deutschland GmbH

发明人： Matthias Dammasch ,  Marco Haryono ,  Sengül Karasahin ,  Hans-Jürgen Schreier

IPC分类号： B05D3/10 ,  C23C18/40 ,  C23C18/16 ,  H01L21/288 ,  H01L21/768 ,  C25D3/38 ,  C25D5/00 ,  C25D7/12

CPC分类号： C23C18/40 ,  C23C18/1633 ,  C23C18/1653 ,  C23C18/1683 ,  C25D3/38 ,  C25D5/00 ,  C25D7/12 ,  H01L21/288 ,  H01L21/76873 ,  H01L21/76898

摘要： The present invention relates to a method for providing a copper seed layer on top of a barrier layer wherein said seed layer is deposited onto said barrier layer from an aqueous electroless copper plating bath comprising a water-soluble source for Cu(II) ions, a reducing agent for Cu(II) ions, at least one complexing agent for Cu(II) ions and at least one source for hydroxide ions selected from the group consisting of RbOH, CsOH and mixtures thereof. The resulting copper seed layer has a homogeneous thickness distribution and a smooth outer surface which are both desired properties.

公开(公告)号：US10006125B2

公开(公告)日：2018-06-26

申请号：US15163419

申请日：2016-05-24

申请人： TOYO KOHAN CO., LTD.

发明人： Nobuaki Mukai

IPC分类号： C23C18/18 ,  C23C18/44 ,  B32B15/01 ,  H01M8/0228 ,  C23C18/38 ,  C23C18/40 ,  C23C30/00 ,  C23C18/16 ,  C23C28/02 ,  C23C18/32 ,  C23C18/54 ,  C23C18/34 ,  C23C18/52 ,  C23C28/00 ,  B32B15/04 ,  C23C18/48 ,  C23C18/50 ,  C23C18/42 ,  C22C19/00 ,  C22C5/02 ,  C22C21/06 ,  C23C18/36

CPC分类号： C23C18/1831 ,  B32B15/01 ,  B32B15/017 ,  B32B15/018 ,  B32B15/043 ,  C22C5/02 ,  C22C19/00 ,  C22C21/06 ,  C23C18/16 ,  C23C18/1633 ,  C23C18/165 ,  C23C18/1651 ,  C23C18/1653 ,  C23C18/32 ,  C23C18/34 ,  C23C18/36 ,  C23C18/38 ,  C23C18/40 ,  C23C18/42 ,  C23C18/44 ,  C23C18/48 ,  C23C18/50 ,  C23C18/52 ,  C23C18/54 ,  C23C28/00 ,  C23C28/02 ,  C23C28/021 ,  C23C30/00 ,  C23C30/005 ,  H01M8/0228 ,  Y10T428/12708 ,  Y10T428/12715 ,  Y10T428/12722 ,  Y10T428/12861 ,  Y10T428/12868 ,  Y10T428/12875 ,  Y10T428/12882 ,  Y10T428/12889 ,  Y10T428/12896 ,  Y10T428/12903 ,  Y10T428/1291 ,  Y10T428/12917 ,  Y10T428/12924 ,  Y10T428/12931 ,  Y10T428/12937 ,  Y10T428/12944 ,  Y10T428/12972 ,  Y10T428/2495 ,  Y10T428/24967 ,  Y10T428/24975

摘要： A method of electroless gold plating includes a step of forming an underlying alloy layer on a base material and a step of forming a gold plate layer directly on the underlying alloy layer by electroless reduction plating using a cyanide-free gold plating bath. The underlying alloy layer is formed of an M1-M2-M3 alloy, where M1 is at least one element selected from Ni, Fe, Co, Cu, Zn, where Sn, M2 is at least one element selected from Pd, Re, Pt, Rh, Ag and where Ru, and M3 is at least one element selected from P and B.

公开(公告)号：US09901892B2

公开(公告)日：2018-02-27

申请号：US14651240

申请日：2013-11-20

申请人： GENERAL ELECTRIC COMPANY

发明人： Minghu Guo ,  Chuan Lin ,  Yanfei Gu ,  Wen-Qing Peng ,  Lawrence Bernard Kool ,  Hong Zhou ,  Zhaohui Yang

IPC分类号： B01J8/06 ,  B01J21/04 ,  B01J21/06 ,  B01J23/00 ,  B01J23/02 ,  B01J23/10 ,  B01J23/26 ,  B01J23/34 ,  B01J23/745 ,  B01J23/755 ,  B01J23/76 ,  B01J23/78 ,  B01J35/00 ,  B01J37/02 ,  C10G9/16 ,  C23C8/10 ,  C23C8/80 ,  C23C10/30 ,  C23C24/06 ,  C23C24/10 ,  C23C28/04 ,  C10G75/00 ,  B05D1/02 ,  C23C2/02 ,  C23C16/02 ,  C23C16/44 ,  C23C18/16 ,  C23C18/18 ,  C23C4/134 ,  B01J37/34 ,  B01J37/00 ,  B01J37/08 ,  B01J23/889 ,  B01J23/83 ,  B01J23/86

CPC分类号： B01J8/06 ,  B01J23/002 ,  B01J23/02 ,  B01J23/10 ,  B01J23/26 ,  B01J23/34 ,  B01J23/78 ,  B01J23/83 ,  B01J23/86 ,  B01J23/8892 ,  B01J35/002 ,  B01J37/0036 ,  B01J37/0217 ,  B01J37/0219 ,  B01J37/0225 ,  B01J37/0226 ,  B01J37/0238 ,  B01J37/08 ,  B01J37/343 ,  B01J37/349 ,  B01J2208/06 ,  B01J2523/00 ,  B05D1/02 ,  C10G9/16 ,  C10G75/00 ,  C10G2300/708 ,  C23C2/02 ,  C23C4/134 ,  C23C8/10 ,  C23C8/80 ,  C23C10/30 ,  C23C16/0209 ,  C23C16/44 ,  C23C18/1633 ,  C23C18/18 ,  C23C24/06 ,  C23C24/106 ,  C23C28/04 ,  B01J2523/25 ,  B01J2523/3712 ,  B01J2523/48 ,  B01J2523/36 ,  B01J2523/3706 ,  B01J2523/67 ,  B01J2523/72

摘要： An article including a metal substrate, an anti-coking catalyst layer and an alumina barrier layer disposed between the metal substrate and the anti-coking catalyst layer is provided. A process for making the article is also provided.

公开(公告)号：US20180054894A1

公开(公告)日：2018-02-22

申请号：US15802676

申请日：2017-11-03

申请人： Hamilton Sundstrand Corporation

发明人： Slade R. Culp ,  Sameh Dardona ,  Wayde R. Schmidt

IPC分类号： H05K1/16 ,  H05K3/12 ,  C23C18/16 ,  H05K1/02 ,  H05K1/09 ,  H05K3/46 ,  H05K3/36 ,  B32B37/06

CPC分类号： H05K1/16 ,  B32B37/06 ,  B32B2305/72 ,  C23C18/1633 ,  H05K1/0298 ,  H05K1/092 ,  H05K1/165 ,  H05K3/12 ,  H05K3/36 ,  H05K3/4617 ,  H05K2201/0125 ,  H05K2201/0129 ,  H05K2203/06 ,  H05K2203/1105

摘要： A method for fabricating printed electronics includes printing a trace of an electrical component on a first substrate to form a first layer. The method further includes printing a trace of an electrical component on at least one additional substrate to form at least one additional layer. The first layer is stacked with the at least one additional layer to create an assembled electrical device. At least one of the layers is modified after printing.

公开(公告)号：US20170260640A1

公开(公告)日：2017-09-14

申请号：US15168061

申请日：2016-05-29

申请人： BEFS CO., LTD.

发明人： Changhyeok Bang ,  Seungjin Lee ,  Daeyeong Yun

IPC分类号： C25D3/56 ,  C23C18/48 ,  C23C18/16

CPC分类号： C25D3/56 ,  C23C18/1633 ,  C23C18/48 ,  C25D9/08 ,  C25D9/10 ,  C25D9/12 ,  C25D21/14

摘要： The present invention relates to the lead-zirconate-titanate (PZT) amorphous alloy plating solution which may be used to form a PZT amorphous alloy film having excellent mechanical and physical properties and a method for plating a PZT amorphous alloy using the same. The PZT amorphous alloy plating solution may include a Pb precursor, a Zr precursor, and a Ti precursor. 10˜50 parts by weight of the Zr precursor and 5˜30 parts by weight of the Ti precursor may be included based on 100 parts by weight of the Pb precursor. Accordingly, electrical conductivity can be improved because the PZT amorphous alloy plating solution has a structure which has low crystallinity or which is amorphous. Furthermore, excellent electrical characteristics can be achieved because the PZT amorphous alloy plating solution has excellent conductivity or chemical stability.

公开(公告)号：US09761485B2

公开(公告)日：2017-09-12

申请号：US14796227

申请日：2015-07-10

申请人： Tokyo Electron Limited

发明人： Yuichiro Inatomi ,  Takashi Tanaka

IPC分类号： H01L21/31 ,  H01L21/469 ,  H01L21/768 ,  H01L21/288 ,  C23C18/16 ,  C23C18/18 ,  C23C18/40 ,  C23C18/50 ,  C25D7/00

CPC分类号： H01L21/76874 ,  C23C18/1633 ,  C23C18/1651 ,  C23C18/1653 ,  C23C18/1696 ,  C23C18/1893 ,  C23C18/40 ,  C23C18/50 ,  C25D7/00 ,  H01L21/288 ,  H01L21/76843 ,  H01L21/76873 ,  H01L21/76898

摘要： A catalyst layer can be uniformly formed on an entire surface of a substrate and an entire inner surface of a recess. A catalyst layer forming method of forming the catalyst layer on the substrate includes a first supply processing of forming a substrate surface catalyst layer 22A by supplying a catalyst liquid on the entire surface of the substrate 2; and a second supply processing of forming a recess inner surface catalyst layer 22B by supplying the catalyst liquid to a central portion of the substrate 2 while rotating the substrate 2.

公开(公告)号：US20170170021A1

公开(公告)日：2017-06-15

申请号：US15373724

申请日：2016-12-09

申请人： Tokyo Electron Limited

发明人： Tomohisa Hoshino ,  Keiichi Fujita ,  Masato Hamada

IPC分类号： H01L21/288 ,  H01L21/768 ,  H01L21/3205 ,  C23C18/16

CPC分类号： H01L21/288 ,  C23C18/1619 ,  C23C18/1633 ,  C23C18/1653 ,  C23C18/1675 ,  C23C18/1696 ,  C23C18/1879 ,  C23C18/40 ,  C25D7/123 ,  H01L21/32051 ,  H01L21/76873 ,  H01L21/76874 ,  H01L21/76898

摘要： In a substrate processing apparatus 1, a plating unit 4 includes a catalyst solution supply unit 43a and a plating liquid supply unit 45. By supplying, from the catalyst solution supply unit 43a onto a substrate W1 having an impurity-doped polysilicon film 90 containing a high concentration of impurities on a surface thereof, an alkaline catalyst solution L1 containing a complex of a palladium ion and a monocyclic 5- or 6-membered aromatic or aliphatic heterocyclic compound having one or two nitrogen atoms as a heteroatom, a catalyst layer 91 is formed on a surface of the impurity-doped polysilicon film 90 of the substrate W1. After the catalyst solution L1 is supplied, an electroless plating layer 92 is formed on the catalyst layer 91 formed on a substrate W2 by supplying a plating liquid M1 from the plating liquid supply unit 45 onto the substrate W2.

公开(公告)号：US09663861B2

公开(公告)日：2017-05-30

申请号：US15008051

申请日：2016-01-27

申请人： TAIYO YUDEN CO., LTD.

发明人： Kazushige Hatakeyama ,  Hitoshi Tsukidate

IPC分类号： H03H9/25 ,  H03H9/64 ,  H03H3/08 ,  C23C18/16 ,  C25D7/12 ,  C23C18/42

CPC分类号： C23C18/1633 ,  C23C18/1653 ,  C23C18/42 ,  C25D7/123 ,  H03H3/08 ,  H03H9/25 ,  H03H9/64

摘要： An acoustic wave device includes: a substrate; an acoustic wave element that is formed on the substrate; a first wiring that is formed on the substrate and electrically connected to the acoustic wave element; a second wiring that is formed above the substrate via an air gap, and includes an edge fixed to the first wiring; a fixer that is formed on an edge of the first wiring, projects upwardly, and is fixed to the second wiring; and a projection that contacts the fixer, projects upwardly, and is formed on the edge of the first wiring and on an outside of the second wiring in a direction intersecting an extension direction of the second wiring.

公开(公告)号：US20170137949A1

公开(公告)日：2017-05-18

申请号：US15350557

申请日：2016-11-14

申请人： ANSALDO ENERGIA SWITZERLAND AG

发明人： Maryam BAHRAINI HASANI ,  Hans-Peter BOSSMANN

IPC分类号： C23F15/00 ,  C23C18/16 ,  C25D17/00 ,  C23C4/129 ,  C25D13/02 ,  C25D9/04 ,  C23C4/134 ,  C23C4/02

CPC分类号： C23F15/00 ,  C23C4/02 ,  C23C4/08 ,  C23C4/129 ,  C23C4/134 ,  C23C18/1633 ,  C23C18/1662 ,  C23C24/04 ,  C23C30/00 ,  C25D9/04 ,  C25D13/02 ,  C25D15/00 ,  C25D17/00 ,  F01D5/288 ,  F05D2300/224 ,  F05D2300/2261 ,  F05D2300/512

摘要： A power plant component is disclosed having a substrate, the surface of which is coated with a functionally graded coating of a predetermined thickness, with anti-erosion, anti-corrosion and anti-fouling properties. Improved operation properties are achieved by the functionally graded coating having a corrosion resistant portion, and an erosion resistant and hydrophobic portion, whereby the functionally graded coating is a composite coating consisting of a single layer.

公开(公告)号：US20170096113A1

公开(公告)日：2017-04-06

申请号：US15262513

申请日：2016-09-12

申请人： TOYODA GOSEI CO., LTD.

发明人： Yuji HOTTA ,  Koji NAKATANI

IPC分类号： B60R13/02 ,  C23C18/38 ,  C23C18/16 ,  C25D3/12 ,  C25D3/08 ,  C25D5/48 ,  C25D5/14 ,  C23C18/32 ,  C25D3/06

CPC分类号： B60R13/02 ,  B32B15/08 ,  C23C18/1633 ,  C23C18/1653 ,  C23C18/2086 ,  C23C18/285 ,  C23C18/30 ,  C23C18/32 ,  C23C18/38 ,  C23C30/00 ,  C25D3/06 ,  C25D3/08 ,  C25D3/12 ,  C25D5/14 ,  C25D5/48 ,  C25D11/36 ,  Y10T428/12556 ,  Y10T428/12569 ,  Y10T428/12611 ,  Y10T428/12618 ,  Y10T428/1266 ,  Y10T428/12667 ,  Y10T428/12826 ,  Y10T428/12847 ,  Y10T428/12854 ,  Y10T428/12882 ,  Y10T428/12903 ,  Y10T428/1291 ,  Y10T428/12944 ,  Y10T428/264 ,  Y10T428/265 ,  Y10T428/31678 ,  Y10T428/31681

摘要： A black plated resin part includes a resin base material, an underlying plating layer including a copper plating layer and a nickel plating layer formed in this order on the resin base material, a black chromium plating layer formed on the nickel plating layer, formed of trivalent chromium, and having a film thickness of not less than 015 μm, and a corrosion resistant film formed on the black chromium plating layer, formed of chromic phosphate or molybdenum phosphate, and having a film thickness of not less than 7 nm. A brightness of the black chromium plating layer seen through the corrosion resistant film is expressed by an L* value of not more than 54 based on the L*a*b* color system.