公开(公告)号：US11533811B2

公开(公告)日：2022-12-20

申请号：US17369914

申请日：2021-07-07

申请人： Au Optronics Corporation

发明人： Yun Cheng ,  Hao-An Chuang ,  Hsi-Hung Chen ,  Chun-Yueh Hou ,  Fan-Yu Chen

IPC分类号： H05K3/28 ,  H05K1/11 ,  H05K1/18 ,  F21Y113/10 ,  F21Y115/10

摘要： An electronic device includes a substrate, multiple side wires, and a protection structure. The substrate has a first main surface, a side surface, and a first multi-turning surface connected between the first main surface and the side surface. The first multi-turning surface includes multiple first turning surfaces with differing normal directions. The side wires are disposed on the substrate. Each of the side wires extends from the first main surface over the first multi-turning surface to the side surface. The protection structure is disposed on the substrate and includes a wire protection part covering the side wires. The wire protection part has a first thickness at the side surface, a second thickness at the first main surface, and a third thickness at at least one of the first turning surfaces. The first thickness is greater than the second thickness, and the second thickness is greater than the third thickness.

公开(公告)号：US11963300B2

公开(公告)日：2024-04-16

申请号：US17371135

申请日：2021-07-09

申请人： Au Optronics Corporation

发明人： Chun-Yueh Hou ,  Hao-An Chuang ,  Fan-Yu Chen ,  Hsi-Hung Chen ,  Yun Cheng ,  Wen-Chang Hsieh ,  Chih-Wen Lu

IPC分类号： H05K1/11 ,  H05K3/22 ,  H05K3/46

CPC分类号： H05K1/111 ,  H05K3/22 ,  H05K3/4644 ,  H05K2201/10227

摘要： A panel device including a substrate, a conductor pad, a turning wire, and a circuit board is provided. The substrate has a first surface and a second surface connected to the first surface while a normal direction of the second surface is different from a normal direction of the first surface. The conductor pad is disposed on the first surface of the substrate. The turning wire is disposed on the substrate and extends from the first surface to the second surface. The turning wire includes a wiring layer in contact with the conductor pad and a wire covering layer covering the wiring layer. The circuit board is bonded to and electrically connected to the wire covering layer. A manufacturing method of a panel device is also provided herein.