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公开(公告)号：US11552230B2
公开(公告)日：2023-01-10
申请号：US17008607
申请日：2020-08-31
发明人： Shang-Jie Wu , Hao-An Chuang , Yu-Chieh Kuo , He-Yi Cheng , Che-Chia Chang , Yi-Jung Chen , Yi-Fan Chen , Yu-Hsun Chiu , Mei-Yi Li , Yu-Chin Wu
摘要： A pixel array substrate includes a base, pixel structures, first bonding pads, first wirings, and a first testing element. The pixel structures are disposed on an active area of a first surface of the base. The first bonding pads are disposed on a peripheral region of the first surface. Each of the first wirings is disposed on a corresponding first bonding pad, a first sidewall of the base, and a corresponding second bonding pad. The first testing element is disposed on the active area of the first surface and has a first testing line. The first testing line is electrically connected to at least one of the first bonding pads, and an end of the first testing line is substantially aligned with an edge of the base.
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公开(公告)号：US11533811B2
公开(公告)日：2022-12-20
申请号：US17369914
申请日：2021-07-07
发明人： Yun Cheng , Hao-An Chuang , Hsi-Hung Chen , Chun-Yueh Hou , Fan-Yu Chen
IPC分类号： H05K3/28 , H05K1/11 , H05K1/18 , F21Y113/10 , F21Y115/10
摘要： An electronic device includes a substrate, multiple side wires, and a protection structure. The substrate has a first main surface, a side surface, and a first multi-turning surface connected between the first main surface and the side surface. The first multi-turning surface includes multiple first turning surfaces with differing normal directions. The side wires are disposed on the substrate. Each of the side wires extends from the first main surface over the first multi-turning surface to the side surface. The protection structure is disposed on the substrate and includes a wire protection part covering the side wires. The wire protection part has a first thickness at the side surface, a second thickness at the first main surface, and a third thickness at at least one of the first turning surfaces. The first thickness is greater than the second thickness, and the second thickness is greater than the third thickness.
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公开(公告)号：US09503672B2
公开(公告)日：2016-11-22
申请号：US14946906
申请日：2015-11-20
发明人： Hao-An Chuang
IPC分类号： H04N5/655 , H04N5/64 , G02F1/1333 , G06F1/16
CPC分类号： H04N5/64 , G02F1/1333 , G02F1/133308 , G02F1/13452 , G02F2001/133331 , G06F1/16 , G06F1/1601 , G06F1/1605 , G06F1/1637 , G06F1/1688 , G06F2200/1612
摘要： A display module having strengthened structure is provided. The display module includes a display panel and a transparent cover. The display panel has a display face and includes a circuit area. The circuit area is disposed close to a first side of the display panel. The transparent cover is attached to the display face and has a first edge corresponding to the first side, wherein the first edge extends beyond the first side. The transparent cover comprises a first recessed area, and the first recessed area shrinks from the first edge toward a center of the transparent cover. An edge of the first recessed area retreats behind the first side and exposes the circuit area.
摘要翻译： 提供具有加强结构的显示模块。 显示模块包括显示面板和透明盖。 显示面板具有显示面，并且包括电路区域。 电路区域靠近显示面板的第一侧设置。 透明盖附接到显示面，并且具有对应于第一侧的第一边缘，其中第一边缘延伸超过第一边。 透明盖包括第一凹陷区域，并且第一凹陷区域从第一边缘朝向透明盖的中心收缩。 第一凹陷区域的边缘在第一侧后面退避并暴露电路区域。
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公开(公告)号：US11626272B2
公开(公告)日：2023-04-11
申请号：US17369968
申请日：2021-07-08
发明人： Chun-Yueh Hou , Hao-An Chuang
摘要： A sputtering equipment is adapted for sputtering substrates, where each of the substrates includes two opposite main surfaces and side surfaces connecting the two main surfaces. The sputtering equipment includes a cavity, at least one target set and a carrier box. The at least one target set is disposed in the cavity, the target set includes targets, and the targets are staggered at both side surfaces of an axis. The carrier box is movably disposed so as to enter and exit the cavity, and includes substrate accommodating grooves. The substrates are adapted for being placed in the substrate accommodating grooves of the carrier box, and at least one side surface of each of the substrates is located outside the carrier box and protrudes toward the at least one target set.
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公开(公告)号：US11075224B2
公开(公告)日：2021-07-27
申请号：US16813861
申请日：2020-03-10
发明人： Hao-An Chuang , Wen-Fang Sung
IPC分类号： H01L27/12 , G02F1/13 , H05K1/14 , H05K1/11 , H05K3/00 , H05K3/36 , G02F1/1339 , G02F1/1362 , G02F1/1368 , G02F1/1345
摘要： A display device includes a first substrate and a flexible circuit board. Data lines, scan lines, thin film transistors, gate contacts, and source contacts are disposed on the first substrate. The scan lines are intersected with the data lines. The thin film transistors are respectively connected to the data lines and the scan lines. The gate contacts are connected to the scan lines. The source contacts are connected to the data lines. The display device further includes first conductive patterns disposed on a side of the first substrate, and the first conductive patterns are connected to at least some of the gate contacts on the side of the first substrate. First pads of the flexible circuit board are connected to the first conductive patterns.
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公开(公告)号：US10129988B2
公开(公告)日：2018-11-13
申请号：US15801957
申请日：2017-11-02
发明人： Kuan-Hsun Chen , Hao-An Chuang , Hui-Di Lu
IPC分类号： H05K5/00 , H05K1/18 , H05K1/11 , G02F1/133 , G02F1/1345
摘要： A display panel includes a first substrate, a second substrate, a display medium layer, first peripheral wires, and second peripheral wires. The first substrate has at least one first side surface. The second substrate is disposed opposite to the first substrate, and has at least one second side surface adjacent to the first side surface. Each first peripheral wire includes a first signal line, a first fan-out portion, and a first pad. The first signal lines are disposed between the first substrate and the second substrate, and the first fan-out portions are disposed on the first side surface of the first substrate. Each second peripheral wire includes a second signal line, a second fan-out portion, and a second pad. The second signal lines are disposed between the first substrate and the second substrate, and the second fan-out portions are disposed on the second side surface of the second substrate.
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公开(公告)号：US20160191844A1
公开(公告)日：2016-06-30
申请号：US14946906
申请日：2015-11-20
发明人： Hao-An Chuang
IPC分类号： H04N5/64
CPC分类号： H04N5/64 , G02F1/1333 , G02F1/133308 , G02F1/13452 , G02F2001/133331 , G06F1/16 , G06F1/1601 , G06F1/1605 , G06F1/1637 , G06F1/1688 , G06F2200/1612
摘要： A display module having strengthened structure is provided. The display module includes a display panel and a transparent cover. The display panel has a display face and includes a circuit area. The circuit area is disposed close to a first side of the display panel. The transparent cover is attached to the display face and has a first edge corresponding to the first side, wherein the first edge extends beyond the first side. The transparent cover comprises a first recessed area, and the first recessed area shrinks from the first edge toward a center of the transparent cover. An edge of the first recessed area retreats behind the first side and exposes the circuit area.
摘要翻译： 提供具有加强结构的显示模块。 显示模块包括显示面板和透明盖。 显示面板具有显示面，并且包括电路区域。 电路区域靠近显示面板的第一侧设置。 透明盖附接到显示面，并且具有对应于第一侧的第一边缘，其中第一边缘延伸超过第一边。 透明盖包括第一凹陷区域，并且第一凹陷区域从第一边缘朝向透明盖的中心收缩。 第一凹陷区域的边缘在第一侧后面退避并暴露电路区域。
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公开(公告)号：US11963300B2
公开(公告)日：2024-04-16
申请号：US17371135
申请日：2021-07-09
发明人： Chun-Yueh Hou , Hao-An Chuang , Fan-Yu Chen , Hsi-Hung Chen , Yun Cheng , Wen-Chang Hsieh , Chih-Wen Lu
CPC分类号： H05K1/111 , H05K3/22 , H05K3/4644 , H05K2201/10227
摘要： A panel device including a substrate, a conductor pad, a turning wire, and a circuit board is provided. The substrate has a first surface and a second surface connected to the first surface while a normal direction of the second surface is different from a normal direction of the first surface. The conductor pad is disposed on the first surface of the substrate. The turning wire is disposed on the substrate and extends from the first surface to the second surface. The turning wire includes a wiring layer in contact with the conductor pad and a wire covering layer covering the wiring layer. The circuit board is bonded to and electrically connected to the wire covering layer. A manufacturing method of a panel device is also provided herein.
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公开(公告)号：US11923491B2
公开(公告)日：2024-03-05
申请号：US17376189
申请日：2021-07-15
发明人： Chih-Wen Lu , Hao-An Chuang , Chun-Yueh Hou
CPC分类号： H01L33/62 , G09G3/32 , H01L27/156 , H01L33/005 , H01L2933/0066
摘要： An electronic device, including a substrate, an edge wire, a first protection layer, and a second protection layer, is provided. The substrate has a first surface, a second surface, and a side surface connecting the first surface and the second surface. A normal vector of the side surface is different from the first surface and the second surface. The edge wire is configured on the substrate, extending from the first surface to the second surface while passing through the side surface. The first protection layer is configured on the edge wire. The edge wire is sandwiched between the substrate and the first protection layer. The edge wire and the first protection layer form an undercut structure. The second protection layer is configured on the substrate and fills the undercut structure. A manufacturing method of an electronic device is also provided.
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公开(公告)号：US20210359180A1
公开(公告)日：2021-11-18
申请号：US17008607
申请日：2020-08-31
发明人： Shang-Jie Wu , Hao-An Chuang , Yu-Chieh Kuo , He-Yi Cheng , Che-Chia Chang , Yi-Jung Chen , Yi-Fan Chen , Yu-Hsun Chiu , Mei-Yi Li , Yu-Chin Wu
摘要： A pixel array substrate includes a base, pixel structures, first bonding pads, first wirings, and a first testing element. The pixel structures are disposed on an active area of a first surface of the base. The first bonding pads are disposed on a peripheral region of the first surface. Each of the first wirings is disposed on a corresponding first bonding pad, a first sidewall of the base, and a corresponding second bonding pad. The first testing element is disposed on the active area of the first surface and has a first testing line. The first testing line is electrically connected to at least one of the first bonding pads, and an end of the first testing line is substantially aligned with an edge of the base.
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