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公开(公告)号：US11626272B2
公开(公告)日：2023-04-11
申请号：US17369968
申请日：2021-07-08
发明人： Chun-Yueh Hou , Hao-An Chuang
摘要： A sputtering equipment is adapted for sputtering substrates, where each of the substrates includes two opposite main surfaces and side surfaces connecting the two main surfaces. The sputtering equipment includes a cavity, at least one target set and a carrier box. The at least one target set is disposed in the cavity, the target set includes targets, and the targets are staggered at both side surfaces of an axis. The carrier box is movably disposed so as to enter and exit the cavity, and includes substrate accommodating grooves. The substrates are adapted for being placed in the substrate accommodating grooves of the carrier box, and at least one side surface of each of the substrates is located outside the carrier box and protrudes toward the at least one target set.
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公开(公告)号：US11533811B2
公开(公告)日：2022-12-20
申请号：US17369914
申请日：2021-07-07
发明人： Yun Cheng , Hao-An Chuang , Hsi-Hung Chen , Chun-Yueh Hou , Fan-Yu Chen
IPC分类号： H05K3/28 , H05K1/11 , H05K1/18 , F21Y113/10 , F21Y115/10
摘要： An electronic device includes a substrate, multiple side wires, and a protection structure. The substrate has a first main surface, a side surface, and a first multi-turning surface connected between the first main surface and the side surface. The first multi-turning surface includes multiple first turning surfaces with differing normal directions. The side wires are disposed on the substrate. Each of the side wires extends from the first main surface over the first multi-turning surface to the side surface. The protection structure is disposed on the substrate and includes a wire protection part covering the side wires. The wire protection part has a first thickness at the side surface, a second thickness at the first main surface, and a third thickness at at least one of the first turning surfaces. The first thickness is greater than the second thickness, and the second thickness is greater than the third thickness.
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公开(公告)号：US11963300B2
公开(公告)日：2024-04-16
申请号：US17371135
申请日：2021-07-09
发明人： Chun-Yueh Hou , Hao-An Chuang , Fan-Yu Chen , Hsi-Hung Chen , Yun Cheng , Wen-Chang Hsieh , Chih-Wen Lu
CPC分类号： H05K1/111 , H05K3/22 , H05K3/4644 , H05K2201/10227
摘要： A panel device including a substrate, a conductor pad, a turning wire, and a circuit board is provided. The substrate has a first surface and a second surface connected to the first surface while a normal direction of the second surface is different from a normal direction of the first surface. The conductor pad is disposed on the first surface of the substrate. The turning wire is disposed on the substrate and extends from the first surface to the second surface. The turning wire includes a wiring layer in contact with the conductor pad and a wire covering layer covering the wiring layer. The circuit board is bonded to and electrically connected to the wire covering layer. A manufacturing method of a panel device is also provided herein.
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公开(公告)号：US11923491B2
公开(公告)日：2024-03-05
申请号：US17376189
申请日：2021-07-15
发明人： Chih-Wen Lu , Hao-An Chuang , Chun-Yueh Hou
CPC分类号： H01L33/62 , G09G3/32 , H01L27/156 , H01L33/005 , H01L2933/0066
摘要： An electronic device, including a substrate, an edge wire, a first protection layer, and a second protection layer, is provided. The substrate has a first surface, a second surface, and a side surface connecting the first surface and the second surface. A normal vector of the side surface is different from the first surface and the second surface. The edge wire is configured on the substrate, extending from the first surface to the second surface while passing through the side surface. The first protection layer is configured on the edge wire. The edge wire is sandwiched between the substrate and the first protection layer. The edge wire and the first protection layer form an undercut structure. The second protection layer is configured on the substrate and fills the undercut structure. A manufacturing method of an electronic device is also provided.
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