公开(公告)号：US10365430B2

公开(公告)日：2019-07-30

申请号：US15653543

申请日：2017-07-19

申请人： Avary Holding (Shenzhen) Co., Limited. ,  HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd.

发明人： Xian-Qin Hu ,  Fu-Yun Shen ,  Ming-Jaan Ho ,  Feng-Yuan Hu

IPC分类号： H01P3/08 ,  G02B6/036 ,  H01G4/06 ,  H01L23/522 ,  H01L21/768 ,  B32B27/38 ,  H01L23/532 ,  H01L27/146

摘要： A method for manufacturing high frequency signal transmission structure comprises: providing two dielectric layers, each of the two dielectric layers defining a top surface and a bottom surface and comprising a channel with a bottom open end opened at the top surface and a top open end opened at the bottom surface, an inner diameter of the each of the two channels gradually reducing further from the top open end to the bottom open end; providing a circuit layer with a transmission portion; providing two copper plates; combining the circuit layer, the two dielectric layers and the two copper plates to form a combination; providing a shielding layer around the two air chambers; and providing at least one solder mask covering the shielding layer. The present disclosure also provides a high frequency signal transmission structure obtained by the method.