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公开(公告)号：US10660218B2
公开(公告)日：2020-05-19
申请号：US15957875
申请日：2018-04-19
申请人： HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd. , Avary Holding (Shenzhen) Co., Limited.
发明人： Xian-Qin Hu , Li-Kun Liu , Yan-Lu Li , Ming-Jaan Ho
IPC分类号： H05K3/46 , H05K3/00 , H05K3/42 , H01L23/498 , H05K1/18 , H01L21/48 , H05K1/11 , H05K3/28 , H05K3/06
摘要： A multilayer circuit board comprises an inner circuit unit having at least one solder portion, and at least one outer circuit board coupled with the inner circuit unit. The inner circuit unit connects with the outer circuit board by an insulation colloid. At least one side of the inner circuit unit does not extend to edges of the multilayer circuit board. The at least one outer circuit board forms at least one through-hole and at least one conductive hole. The at least one conductive hole which is internally-plated with copper extends from the at least one outer circuit board to the inner circuit unit. A method of manufacturing the multilayer circuit board is also disclosed.
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公开(公告)号：US11294285B2
公开(公告)日：2022-04-05
申请号：US16843123
申请日：2020-04-08
申请人： HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd. , Avary Holding (Shenzhen) Co., Limited.
发明人： Xian-Qin Hu , Mei Yang , Jun Dai
IPC分类号： G03F7/095 , C23C30/00 , H05K3/38 , H05K3/06 , C23G1/10 , C23C28/02 , H05K3/40 , H05K3/18 , H05K1/09 , C23F1/44 , C23F1/02 , G03F7/20
摘要： A method for manufacturing the circuit board comprises following steps of forming a silver layer on each of two opposite surfaces of an insulating substrate, and forming a copper layer on each silver layer, thereby obtaining a middle structure; defining at least one through-hole on the middle structure, and each through-hole extending through each copper layer; forming a copper wiring layer on the copper layers to cover each through-hole and a portion region of the copper layers, the copper wiring layer comprising a copper conductive structure passing through each through-hole, the copper conductive structure connecting the copper layers; removing the copper layers not covered by the copper wiring layer; and etching the silver layers to form a silver wiring layer corresponding to the copper wiring layer, wherein a first etching liquid, which does not etch the copper wiring layer, is used for etching the silver layers.
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公开(公告)号：US11140785B2
公开(公告)日：2021-10-05
申请号：US16710104
申请日：2019-12-11
申请人： HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd. , Avary Holding (Shenzhen) Co., Limited.
发明人： Xian-Qin Hu , Cheng-Jia Li
摘要： A flexible printed circuit board includes a base layer and a pattern line. At least one communication hole penetrating opposite surfaces of the base layer. The pattern line includes two conductive circuit layers formed on the opposite surfaces of the base layer. At least one conductive pole are formed in the at least one communication hole and electrically connects the two conductive circuit layers. A gap being is formed between the conductive pole and the base layer.
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公开(公告)号：US10542627B2
公开(公告)日：2020-01-21
申请号：US16051107
申请日：2018-07-31
申请人： HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd. , Avary Holding (Shenzhen) Co., Limited.
发明人： Xian-Qin Hu , Cheng-Jia Li
摘要： A method for manufacturing a flexible printed circuit board includes having a base layer, and creating a pattern line and at least one conductive pole. The base layer defines at least one communication hole penetrating through the base layer. The pattern line includes two conductive circuit layers formed on opposite surfaces of the base layer. The at least one conductive pole is formed in the at least one communication hole and electrically connects the two conductive circuit layers. A diameter of each conductive pole is less than a diameter of a communication hole.
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公开(公告)号：US10136207B2
公开(公告)日：2018-11-20
申请号：US15666023
申请日：2017-08-01
申请人： Avary Holding (Shenzhen) Co., Limited. , HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd.
发明人： Xian-Qin Hu , Fu-Wei Zhong , Yi-Qiang Zhuang , Chun-Ming Zhou
摘要： A printed circuit board used as a voice coil includes N board units stacked over one another, each board unit having a first electrically connecting region and a second electrically connecting region, all of the first electrically connecting regions being stacked over one another, all of the second electrically connecting regions being stacked over one another, each board unit having a first circuit structure, a base, and a second circuit structure arranged from top to bottom, in each two adjacent board units, the first electrically connecting region of the second circuit structure of an upper board unit being electrically connected in series with the first electrically connecting region of the first circuit structure of a lower board unit, in each board unit, the first circuit structure being electrically connected in series with the second circuit structure in the second electrically connecting region.
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公开(公告)号：US10653015B2
公开(公告)日：2020-05-12
申请号：US16255236
申请日：2019-01-23
申请人： HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd. , Avary Holding (Shenzhen) Co., Limited.
发明人： Xian-Qin Hu , Li-Kun Liu , Yan-Lu Li , Ming-Jaan Ho
IPC分类号： H05K3/46 , H05K1/11 , H05K1/18 , H01L23/498 , H01L21/48 , H05K3/00 , H05K3/42 , H05K3/28 , H05K3/06
摘要： A multilayer circuit board comprises an inner circuit unit having at least one solder portion, and at least one outer circuit board coupled with the inner circuit unit. The inner circuit unit connects with the outer circuit board by an insulation colloid. At least one side of the inner circuit unit does not extend to edges of the multilayer circuit board. The at least one outer circuit board forms at least one through-hole and at least one conductive hole. The at least one conductive hole which is internally-plated with copper extends from the at least one outer circuit board to the inner circuit unit. A method of manufacturing the multilayer circuit board is also disclosed.
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公开(公告)号：US10321561B2
公开(公告)日：2019-06-11
申请号：US15643121
申请日：2017-07-06
申请人： Avary Holding (Shenzhen) Co., Limited. , HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd.
发明人： Xian-Qin Hu , Ming-Jaan Ho
摘要： A flexible printed circuit board (PCB), a method for manufacturing the flexible PCB, and a PCB structure having the flexible PCB are disclosed. A flexible printed circuit board includes a first conductive pattern layer, a second conductive pattern layer, a plurality of first conductive pillars, and a plurality of second conductive pillars. Each of the plurality of first conductive pillars electrically connects to the first conductive pattern layer and is spaced from the second conductive pattern layer, and a plurality of second conductive pillars electrically connects to the second conductive pattern layer and is spaced from the first conductive pattern layer. The plurality of first conductive pillars and the plurality of second conductive pillars are exposed from one surface of the flexible printed circuit board to form a plurality of electrical contact pads.
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公开(公告)号：US10791625B2
公开(公告)日：2020-09-29
申请号：US16392165
申请日：2019-04-23
申请人： Avary Holding (Shenzhen) Co., Limited. , HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd.
发明人： Xian-Qin Hu , Ming-Jaan Ho
IPC分类号： H01K3/10 , H05K1/02 , H05K1/11 , H05K3/40 , H05K1/18 , H05K1/14 , H05K3/22 , H05K3/24 , H05K3/42
摘要： A method for manufacturing a flexible printed circuit board, comprising: providing a flexible printed circuit substrate; defining first through holes and second through holes through the flexible printed circuit substrate; and forming first conductive pillars and second conductive pillars; and defining first grooves by removing a portion of each first conductive pillar and defining second grooves by removing a portion of each second conductive pillar; the first grooves and the second grooves are defined from an outer surface of the flexible printed circuit board on the second conductive pattern layer side to a surface of the second conductive pattern layer away from the first conductive pattern layer; each of the first grooves is aligned with and corresponds to one first conductive pillar, and each of the second grooves is aligned with and corresponds to one second conductive pillar.
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公开(公告)号：US10681824B1
公开(公告)日：2020-06-09
申请号：US16705398
申请日：2019-12-06
申请人： HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd. , Avary Holding (Shenzhen) Co., Limited.
发明人： Jian-Yi Hao , Yan-Lu Li , Xian-Qin Hu , Ming-Hua Du
摘要： A method for manufacturing a waterproof circuit board comprises steps of providing a first wiring substrate suitable for high-frequency transmissions. The first wiring substrate includes a first copper layer and a first conductive wiring layer. A waterproof layer is formed on exposed surfaces of the first wiring substrate. A second wiring substrate suitable for low-frequency transmissions defines a receiving groove. The second wiring substrate includes a second copper layer and defines a first blind hole. The first wiring substrate is pressed in the receiving groove. A first conductive portion is formed in the first blind hole to electrically connect the first conductive wiring layer and the second copper layer.
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公开(公告)号：US10365430B2
公开(公告)日：2019-07-30
申请号：US15653543
申请日：2017-07-19
申请人： Avary Holding (Shenzhen) Co., Limited. , HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd.
发明人： Xian-Qin Hu , Fu-Yun Shen , Ming-Jaan Ho , Feng-Yuan Hu
IPC分类号： H01P3/08 , G02B6/036 , H01G4/06 , H01L23/522 , H01L21/768 , B32B27/38 , H01L23/532 , H01L27/146
摘要： A method for manufacturing high frequency signal transmission structure comprises: providing two dielectric layers, each of the two dielectric layers defining a top surface and a bottom surface and comprising a channel with a bottom open end opened at the top surface and a top open end opened at the bottom surface, an inner diameter of the each of the two channels gradually reducing further from the top open end to the bottom open end; providing a circuit layer with a transmission portion; providing two copper plates; combining the circuit layer, the two dielectric layers and the two copper plates to form a combination; providing a shielding layer around the two air chambers; and providing at least one solder mask covering the shielding layer. The present disclosure also provides a high frequency signal transmission structure obtained by the method.
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