公开(公告)号：US20220279647A1

公开(公告)日：2022-09-01

申请号：US17748300

申请日：2022-05-19

申请人： Avary Holding (Shenzhen) Co., Limited. ,  QING DING PRECISION ELECTRONICS (HUAIAN) CO.,LTD ,  GARUDA TECHNOLOGY CO., LTD.

发明人： WEI-LIANG WU ,  JIA-HE LI

IPC分类号： H05K1/02 ,  H05K1/11 ,  H05K1/18 ,  G02B6/36 ,  H05K3/34 ,  H05K3/46

摘要： A circuit board includes a substrate, a first inner circuit layer, a second inner circuit layer, a first insulating layer, a first optical fiber extending along a first direction, an optical component, an electrical component, a transparent insulating layer, a first inclined surface, a first reflective layer, a second inclined surface, a second reflective layer, and a second optical fiber extending along a second direction.

公开(公告)号：US20220174813A1

公开(公告)日：2022-06-02

申请号：US17125526

申请日：2020-12-17

申请人： Avary Holding (Shenzhen) Co., Limited. ,  QING DING PRECISION ELECTRONICS (HUAIAN) CO.,LTD ,  GARUDA TECHNOLOGY CO., LTD.

发明人： WEI-LIANG WU ,  JIA-HE LI

IPC分类号： H05K1/02 ,  H05K3/46 ,  H05K1/11 ,  H05K1/18

摘要： A circuit board includes a substrate, a first inner circuit layer, a second inner circuit layer, a first insulating layer, a first optical fiber extending along a first direction, an optical component, an electrical component, a transparent insulating layer, a first inclined surface, a first reflective layer, a second inclined surface, a second reflective layer, and a second optical fiber extending along a second direction.

公开(公告)号：US20220377906A1

公开(公告)日：2022-11-24

申请号：US17330972

申请日：2021-05-26

申请人： Avary Holding (Shenzhen) Co., Limited. ,  QING DING PRECISION ELECTRONICS (HUAIAN) CO.,LTD ,  GARUDA TECHNOLOGY CO., LTD.

发明人： JIA-HE LI ,  YONG-CHAO WEI

IPC分类号： H05K3/02 ,  H05K3/32 ,  H05K1/18

摘要： A method for manufacturing a circuit board including the following steps: providing a flexible double-sided metal-clad laminate including a first metal foil, a flexible dielectric layer, and a second metal foil. A carrier is attached to the second metal foil. A first wiring layer including a first wiring region and a second wiring region is formed by the first metal foil. The first wiring region includes a first connecting pad, and the second wiring region includes a connecting pad. A plurality of rigid dielectric blocks surrounded to form an interval and a first groove exposing the first connecting pad is pressed on the flexible dielectric layer to form a rigid dielectric layer. An electronic component is fixed the first groove. The carrier is removed. The intermediate structure is bent along the interval and pressed. A second wiring layer is formed by the second metal foil.

公开(公告)号：US20220230973A1

公开(公告)日：2022-07-21

申请号：US17711252

申请日：2022-04-01

申请人： Avary Holding (Shenzhen) Co., Limited. ,  QING DING PRECISION ELECTRONICS (HUAIAN) CO.,LTD

发明人： YONG-CHAO WEI ,  JIA-HE LI

IPC分类号： H01L23/66 ,  H01L23/552 ,  H01L23/00 ,  H01L21/48

摘要： A packaged antenna circuit structure suitable for 5G use includes a shielding layer, an electronic component, conductive pillars, a first insulation layer, a first stacked structure, an antenna structure, and a second stacked structure. The shielding layer defines a groove to receive the electronic component. The conductive pillars on the shielding layer surround the groove. The first insulation layer covers the shielding layer, the electronic component, and the conductive pillars. The first stacked structure is stacked on a side of the first insulation layer and includes a ground line connecting to the conductive pillars. The antenna structure is stacked on a side of the first stacked structure away from the first insulation layer and connected to the electronic component by the first stacked structure. The second stacked structure is stacked on a side of the first insulation layer away from the first stacked structure.

公开(公告)号：US20220084963A1

公开(公告)日：2022-03-17

申请号：US17030528

申请日：2020-09-24

申请人： Avary Holding (Shenzhen) Co., Limited. ,  QING DING PRECISION ELECTRONICS (HUAIAN) CO.,LTD

发明人： YONG-CHAO WEI ,  JIA-HE LI

IPC分类号： H01L23/66 ,  H01L23/552 ,  H01L23/00 ,  H01L21/48

摘要： A packaged antenna circuit structure suitable for 5G use includes a shielding layer, an electronic component, conductive pillars, a first insulation layer, a first stacked structure, an antenna structure, and a second stacked structure. The shielding layer defines a groove to receive the electronic component. The conductive pillars on the shielding layer surround the groove. The first insulation layer covers the shielding layer, the electronic component, and the conductive pillars. The first stacked structure is stacked on a side of the first insulation layer and includes a ground line connecting to the conductive pillars. The antenna structure is stacked on a side of the first stacked structure away from the first insulation layer and connected to the electronic component by the first stacked structure. The second stacked structure is stacked on a side of the first insulation layer away from the first stacked structure.

公开(公告)号：US20220232152A1

公开(公告)日：2022-07-21

申请号：US17717334

申请日：2022-04-11

申请人： HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd. ,  Avary Holding (Shenzhen) Co., Limited.

发明人： MAN-ZHI PENG ,  RUI-WU LIU ,  JIA-HE LI

IPC分类号： H04N5/225

摘要： A camera module of reduced size includes a baseplate, an image sensor on the baseplate, a mounting bracket with a through hole, and a circuit board. An inner wall of the through hole extends towards a central axis of the through hole to form a platform, a side of the mounting bracket adjacent to the platform extends outward to form a connecting portion. A multilayer coil, a capacitor, and a resistor are formed on the mounting bracket by laser direct structuring, the multilayer coil is of encircling coils arranged from inside to outside on the mounting bracket and surrounds the through hole. The circuit board is connected with the mounting bracket through the connecting portion. A method for manufacturing a lens module is also disclosed.