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公开(公告)号:US20230199966A1
公开(公告)日:2023-06-22
申请号:US17679554
申请日:2022-02-24
申请人: Avary Holding (Shenzhen) Co., Ltd. , HongQiSheng Precision Electronics (QinHuangdao) Co., Ltd. , Garuda Technology Co., Ltd.
发明人: Zi-Qiang GAO , Xian-Qin HU
CPC分类号: H05K1/185 , H05K3/4644 , H05K2201/0154
摘要: A circuit board with embedded components and a method of fabricating the same are provided. The method includes coating an adhesive layer over a substrate, and disposing electronic components on the adhesive layer. Subsequently, after disposing a dielectric layer over the electronic components and the adhesive layer, the substrate and the adhesive layer are removed to form an embedded layer. Then, a wiring layer is formed on the electronic components, and conductive connecting components are formed within the dielectric layer. A cover layer is laminated over the dielectric layer and the wiring layer. Therefore, the electronic components are embedded within the dielectric layer, and the wiring layer electrically connecting to the electronic components are precisely located on a surface of the embedded layer.
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公开(公告)号:US20160183357A1
公开(公告)日:2016-06-23
申请号:US14928166
申请日:2015-10-30
申请人: FuKui Precision Component (Shenzhen) Co., Ltd. , HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd. , Zhen Ding Technology Co., Ltd.
发明人: Ming-Jaan HO , Xian-Qin HU , Yi-Qiang ZHUANG , Fu-Wei ZHONG
CPC分类号: H05K1/024 , H05K1/0221 , H05K3/4623 , H05K3/4697 , H05K2203/061
摘要: A printed circuit board includes a first printed circuit substrate and a second printed circuit substrate. The first printed circuit substrate includes a substrate layer and a first conductive circuit layer. The first conductive circuit layer is formed on the substrate layer. The substrate layer includes at least two first grooves. The first conductive circuit layer includes at least one signal wire. The first grooves are defined in both sides of the signal wire. The second printed circuit substrate is formed on the first printed circuit substrate. The second circuit substrate includes a third copper layer. A second groove is defined in the third copper layer. The first grooves are opposite to the second groove. The first grooves and the second groove form a space. The signal wire is surrounded by air in the space. A method for manufacturing the printed circuit board is also provided.
摘要翻译: 印刷电路板包括第一印刷电路基板和第二印刷电路基板。 第一印刷电路基板包括基板层和第一导电电路层。 第一导电电路层形成在衬底层上。 基底层包括至少两个第一凹槽。 第一导电电路层包括至少一个信号线。 第一个凹槽限定在信号线的两侧。 第二印刷电路基板形成在第一印刷电路基板上。 第二电路基板包括第三铜层。 在第三铜层中限定第二凹槽。 第一凹槽与第二凹槽相对。 第一凹槽和第二凹槽形成空间。 信号线被空间中的空气包围。 还提供了制造印刷电路板的方法。
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