PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME
    2.
    发明申请
    PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME 有权
    印刷电路板及其制造方法

    公开(公告)号:US20160183357A1

    公开(公告)日:2016-06-23

    申请号:US14928166

    申请日:2015-10-30

    摘要: A printed circuit board includes a first printed circuit substrate and a second printed circuit substrate. The first printed circuit substrate includes a substrate layer and a first conductive circuit layer. The first conductive circuit layer is formed on the substrate layer. The substrate layer includes at least two first grooves. The first conductive circuit layer includes at least one signal wire. The first grooves are defined in both sides of the signal wire. The second printed circuit substrate is formed on the first printed circuit substrate. The second circuit substrate includes a third copper layer. A second groove is defined in the third copper layer. The first grooves are opposite to the second groove. The first grooves and the second groove form a space. The signal wire is surrounded by air in the space. A method for manufacturing the printed circuit board is also provided.

    摘要翻译: 印刷电路板包括第一印刷电路基板和第二印刷电路基板。 第一印刷电路基板包括基板层和第一导电电路层。 第一导电电路层形成在衬底层上。 基底层包括至少两个第一凹槽。 第一导电电路层包括至少一个信号线。 第一个凹槽限定在信号线的两侧。 第二印刷电路基板形成在第一印刷电路基板上。 第二电路基板包括第三铜层。 在第三铜层中限定第二凹槽。 第一凹槽与第二凹槽相对。 第一凹槽和第二凹槽形成空间。 信号线被空间中的空气包围。 还提供了制造印刷电路板的方法。