System and method for inspection of a substrate that has a refractive index
    5.
    发明授权
    System and method for inspection of a substrate that has a refractive index 有权
    用于检查具有折射率的基板的系统和方法

    公开(公告)号:US07030978B2

    公开(公告)日:2006-04-18

    申请号:US10423353

    申请日:2003-04-25

    IPC分类号: G01N21/00

    摘要: A system and method for inspection of a substrate having a first refractive index, the method including the steps of: (i) defining an apodization scheme in response to a characteristic of the layer; (ii) applying an apodizer to apodize a beam of radiation in response to the apodization scheme; (iii) directing the apodized beam of radiation to impinge on the substrate, whereby a plurality of rays are reflected from the substrate; whereas the apodized beam of radiation propagates through an at least partially transparent medium having a third refractive index and an at least partially transparent layer having a second refractive index and is subsequently reflected from the substrate; whereas the second refractive index differs from the first refractive index and from the third refractive index; and (iv) detecting at least some of the plurality of reflected rays.

    摘要翻译: 一种用于检查具有第一折射率的衬底的系统和方法,所述方法包括以下步骤:(i)响应于所述层的特性定义变迹方案; (ii)响应于变迹方案应用变迹器来变形辐射束; (iii)引导变迹的辐射束照射到衬底上,由此多个射线从衬底反射; 而变迹的辐射束通过具有第三折射率的至少部分透明的介质和具有第二折射率的至少部分透明的层传播,并随后从基底反射; 而第二折射率与第一折射率和第三折射率不同; 和(iv)检测所述多个反射光线中的至少一些。

    Process and assembly for non-destructive surface inspection
    8.
    发明授权
    Process and assembly for non-destructive surface inspection 有权
    非破坏性表面检查的加工和组装

    公开(公告)号:US06861660B2

    公开(公告)日:2005-03-01

    申请号:US10208113

    申请日:2002-07-29

    IPC分类号: G01N21/95 G01N21/88

    CPC分类号: G01N21/956 G01N21/9501

    摘要: An optical system for detecting defects on a wafer that includes a device for producing a beam and directing the beam onto the wafer surface, producing an illuminated spot on the wafer's surface. The system further includes a detector detecting light, and a mirrored assembly having together with the detector an axis of symmetry about a line perpendicular to the wafer surface. The assembly is configured to receive scattered light from the surface, where the scattered light including a first scattered light part being scattered from the pattern. The assembly is further configured to reflect and focus rotationally symmetrically about the axis of symmetry the scattered light to the detector. The system further includes a device operating with the detector for facilitating detection of a scattered light other than the specified scattered light due to pattern.

    摘要翻译: 一种用于检测晶片上的缺陷的光学系统,其包括用于产生光束并将光束引导到晶片表面上的装置,在晶片的表面上产生照明光斑。 该系统还包括检测光的检测器和与检测器一起围绕垂直于晶片表面的线的对称轴的镜像组件。 所述组件被配置为从所述表面接收散射光,其中所述散射光包括从所述图案散射的第一散射光部分。 组件还被配置为将散射光的对称轴围绕旋转对称地反射并聚焦到检测器。 该系统还包括利用检测器操作的装置,用于便于检测由于图案而导致的特定散射光之外的散射光。

    Process and assembly for non-destructive surface inspection
    9.
    发明授权
    Process and assembly for non-destructive surface inspection 失效
    非破坏性表面检查的加工和组装

    公开(公告)号:US07463351B2

    公开(公告)日:2008-12-09

    申请号:US11034422

    申请日:2005-01-11

    IPC分类号: G01N21/00

    CPC分类号: G01N21/956 G01N21/9501

    摘要: An optical system for detecting defects on a wafer that includes a device for producing a beam and directing the beam onto the wafer surface, producing an illuminated spot on the wafer's surface. The system further includes a detector detecting light, and a mirrored assembly having together with the detector an axis of symmetry about a line perpendicular to the wafer surface. The assembly is configured to receive scattered light from the surface, where the scattered light including a first scattered light part being scattered from the pattern. The assembly is further configured to reflect and focus rotationally symmetrically about the axis of symmetry the scattered light to the detector. The system further includes a device operating with the detector for facilitating detection of a scattered light other than the specified scattered light due to pattern.

    摘要翻译: 一种用于检测晶片上的缺陷的光学系统,其包括用于产生光束并将光束引导到晶片表面上的装置,在晶片的表面上产生照明光斑。 该系统还包括检测光的检测器和与检测器一起围绕垂直于晶片表面的线的对称轴的镜像组件。 所述组件被配置为从所述表面接收散射光,其中所述散射光包括从所述图案散射的第一散射光部分。 组件还被配置为将散射光的对称轴围绕旋转对称地反射并聚焦到检测器。 该系统还包括利用检测器操作的装置,用于便于检测由于图案而导致的特定散射光之外的散射光。

    Process and assmebly for non-destructive surface inspection
    10.
    发明申请
    Process and assmebly for non-destructive surface inspection 失效
    非破坏性表面检查的过程和方法

    公开(公告)号:US20050179891A1

    公开(公告)日:2005-08-18

    申请号:US11034422

    申请日:2005-01-11

    IPC分类号: G01N21/95 G01N21/00

    CPC分类号: G01N21/956 G01N21/9501

    摘要: An optical system for detecting defects on a wafer that includes a device for producing a beam and directing the beam onto the wafer surface, producing an illuminated spot on the wafer's surface. The system further includes a detector detecting light, and a mirrored assembly having together with the detector an axis of symmetry about a line perpendicular to the wafer surface. The assembly is configured to receive scattered light from the surface, where the scattered light including a first scattered light part being scattered from the pattern. The assembly is further configured to reflect and focus rotationally symmetrically about the axis of symmetry the scattered light to the detector. The system further includes a device operating with the detector for facilitating detection of a scattered light other than the specified scattered light due to pattern.

    摘要翻译: 一种用于检测晶片上的缺陷的光学系统,其包括用于产生光束并将光束引导到晶片表面上的装置,在晶片的表面上产生照明光斑。 该系统还包括检测光的检测器和与检测器一起围绕垂直于晶片表面的线的对称轴的镜像组件。 所述组件被配置为从所述表面接收散射光,其中所述散射光包括从所述图案散射的第一散射光部分。 组件还被配置为将散射光的对称轴围绕旋转对称地反射并聚焦到检测器。 该系统还包括利用检测器操作的装置,用于便于检测由于图案而导致的特定散射光之外的散射光。