公开(公告)号：US20240250430A1

公开(公告)日：2024-07-25

申请号：US18101450

申请日：2023-01-25

Applicant: BAE SYSTEMS Information and Electronic Systems Integration Inc.

Inventor： Jean L. Kubwimana ,  Alexander D. Johnson ,  Jacob Tamasy ,  James F. Fung ,  Matthew J. Ney

IPC: H01Q9/04 ,  H01Q1/48 ,  H01Q21/06

CPC classification number: H01Q9/0414 ,  H01Q1/48 ,  H01Q9/045 ,  H01Q21/065

Abstract: An antenna assembly includes a first dielectric material, a ground plane above the first dielectric material, and two or more patch antennas above the ground plane. In an example, the ground plane has a first aperture slot, and a second aperture slot that is non-intersecting with the first aperture slot. The antenna assembly further includes a second dielectric material separating the two or more patch antennas from the ground plane. In an example, the first dielectric material comprises a printed circuit board (PCB). In some examples, the ground plane and the two or more patch antennas are manufactured using additive manufacturing techniques (such as three-dimensional printing techniques), and in some such examples, the second dielectric material includes dielectric foam. For example, the dielectric foam supports the two or more patch antennas above the ground plane.

公开(公告)号：US11969788B1

公开(公告)日：2024-04-30

申请号：US18101447

申请日：2023-01-25

Applicant: BAE SYSTEMS Information and Electronic Systems Integration Inc.

Inventor： Jean L. Kubwimana ,  Alexander D. Johnson ,  Jacob Tamasy ,  James F. Fung ,  Matthew J. Ney

IPC: B22F10/40 ,  B22F10/60 ,  B33Y10/00 ,  B33Y40/20 ,  B33Y80/00 ,  H01Q1/48 ,  H01Q9/04

CPC classification number: B22F10/40 ,  B22F10/60 ,  B33Y10/00 ,  B33Y40/20 ,  B33Y80/00 ,  H01Q1/48 ,  H01Q9/0407

Abstract: A method of manufacturing an antenna assembly includes additively manufacturing an element that is a monolithic structure and that includes (i) a ground plane including one or more aperture slots, (ii) a patch antenna above the ground plane, and (iii) a sacrificial support feature to support the patch antenna above the ground plane. The method further includes applying a dielectric material between the ground plane and the patch antenna. In an example, applying the dielectric material between the ground plane and the patch antenna includes providing a dielectric foam between the ground plane and the patch antenna, where the dielectric foam at least in part supports the patch antenna above the ground plane. The method further includes removing at least a section of the sacrificial support feature, such that any remnant of the support feature does not physically couple the ground plane to the patch antenna.