公开(公告)号：US20190051774A1

公开(公告)日：2019-02-14

申请号：US16078176

申请日：2017-02-23

Applicant: BASF SE

Inventor： Markus FIESS ,  Han Chang PAN ,  Yu Lin WANG ,  Chia Chin CHO

IPC: H01L31/0224 ,  H01B1/22 ,  H01B1/24 ,  C03C4/14 ,  C03C8/18

CPC classification number: H01L31/022425 ,  C03C4/14 ,  C03C8/18 ,  C03C2204/00 ,  C03C2205/00 ,  H01B1/02 ,  H01B1/22 ,  H01B1/24 ,  H01L21/705 ,  Y02E10/50

Abstract: The invention relates to a conductive paste comprising from 30 to 97% by weight of electrically conductive particles, from 0 to 20% by weight of a glass fit, from 3 to 70% by weight of an organic medium and from 0.1 to 67% by weight of a silicone oil, each based on the total mass of the paste, wherein the silicone oil hasa boiling pointor a boiling rangein the range between 180° C. and 350° C. The invention further relates to a use of the conductive paste and a process for producing electrodes on a semiconductor substrate using the paste.